CONN IC DIP SOCKET ZIF 48POS GLD
| Part | Termination Post Length | Termination Post Length | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Housing Material | Contact Material - Post | Features | Mounting Type | Contact Finish - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Termination | Type | Type | Type | Pitch - Post | Pitch - Post | Contact Finish - Mating | Material Flammability Rating | Number of Positions or Pins (Grid) | Current Rating (Amps) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics 48-3573-11 | 0.11 in | 2.78 mm | 0.1 in | 2.54 mm | 10 çin | 0.25 çm | Polyphenylene Sulfide (PPS), Glass Filled | Beryllium Copper | Closed Frame | Through Hole | Gold | 10 çin | 0.25 çm | Beryllium Copper | Solder | 7.62 mm | 0.3 in | DIP, ZIF (ZIP) | 2.54 mm | 0.1 in | Gold | UL94 V-0 | 48 | 1 A |
Aries Electronics 48-3573-10 | 0.11 in | 2.78 mm | 0.1 in | 2.54 mm | 200 µin | 5.08 µm | Polyphenylene Sulfide (PPS), Glass Filled | Beryllium Copper | Closed Frame | Through Hole | Tin | 200 µin | 5.08 µm | Beryllium Copper | Solder | 7.62 mm | 0.3 in | DIP, ZIF (ZIP) | 2.54 mm | 0.1 in | UL94 V-0 | 48 | 1 A | |
Aries Electronics 48-3573-16 | 0.11 in | 2.78 mm | 0.1 in | 2.54 mm | 50 µin | 1.27 µm | Polyphenylene Sulfide (PPS), Glass Filled | Beryllium Nickel | Closed Frame | Through Hole | Nickel Boron | 50 µin | 1.27 µm | Beryllium Nickel | Solder | 7.62 mm | 0.3 in | DIP, ZIF (ZIP) | 2.54 mm | 0.1 in | Nickel Boron | UL94 V-0 | 48 | 1 A |