48-3573 Series

Catalog

CONN IC DIP SOCKET ZIF 48POS GLD

Part	Termination Post Length	Termination Post Length	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Housing Material	Contact Material - Post	Features	Mounting Type	Contact Finish - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Termination	Type	Type	Type	Pitch - Post	Pitch - Post	Contact Finish - Mating	Material Flammability Rating	Number of Positions or Pins (Grid)	Current Rating (Amps)
Aries Electronics 48-3573-11	0.11 in	2.78 mm	0.1 in	2.54 mm	10 çin	0.25 çm	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	Closed Frame	Through Hole	Gold	10 çin	0.25 çm	Beryllium Copper	Solder	7.62 mm	0.3 in	DIP ZIF (ZIP)	2.54 mm	0.1 in	Gold	UL94 V-0	48	1 A
Aries Electronics 48-3573-16	0.11 in	2.78 mm	0.1 in	2.54 mm	50 µin	1.27 µm	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Nickel	Closed Frame	Through Hole	Nickel Boron	50 µin	1.27 µm	Beryllium Nickel	Solder	7.62 mm	0.3 in	DIP ZIF (ZIP)	2.54 mm	0.1 in	Nickel Boron	UL94 V-0	48	1 A
Aries Electronics 48-3573-10	0.11 in	2.78 mm	0.1 in	2.54 mm	200 µin	5.08 µm	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	Closed Frame	Through Hole	Tin	200 µin	5.08 µm	Beryllium Copper	Solder	7.62 mm	0.3 in	DIP ZIF (ZIP)	2.54 mm	0.1 in		UL94 V-0	48	1 A