W25X10 Series
Manufacturer: Winbond Electronics
IC FLASH 1MBIT SPI 100MHZ 8SOIC
| Part | Write Cycle Time - Word | Write Cycle Time - Page | Clock Frequency | Memory Format | Package Name | Memory Interface (Type) | Voltage - Supply (Maximum) | Voltage - Supply (Minimum) | Technology | Memory Type | Mounting Type | Memory Depth | Memory Width | Package Length | Package Width | Operating Temperature (Max) | Operating Temperature (Min) | Memory Size | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics | 3 ms | 3 ms | 100 MHz | FLASH | 8-SOIC | SPI | 3.6 V | 2.7 V | FLASH | Non-Volatile | Surface Mount | 128 K | 8 bit | 0.154 in | 3.9 mm | 85 °C | -40 °C | 1 Mbit | |
Winbond Electronics | 3 ms | 3 ms | 75 MHz | FLASH | 8-SOIC | SPI | 3.6 V | 2.7 V | FLASH | Non-Volatile | Surface Mount | 128 K | 8 bit | 0.154 in | 3.9 mm | 85 °C | -40 °C | 1 Mbit | |
Winbond Electronics | 800 µs | 800 µs | 104 MHz | FLASH | 8-USON | SPI | 3.6 V | 2.3 V | FLASH | Non-Volatile | Surface Mount | 128 K | 8 bit | 2 mm | 3 mm | 85 °C | -40 °C | 1 Mbit | 8-UFDFN Exposed Pad |
Winbond Electronics | 3 ms | 3 ms | 104 MHz | FLASH | 8-SOIC | SPI | 3.6 V | 2.7 V | FLASH | Non-Volatile | Surface Mount | 128 K | 8 bit | 0.154 in | 3.9 mm | 85 °C | -40 °C | 1 Mbit | |
Winbond Electronics | 3 ms | 3 ms | 75 MHz | FLASH | 8-SOIC | SPI | 3.6 V | 2.7 V | FLASH | Non-Volatile | Surface Mount | 128 K | 8 bit | 0.154 in | 3.9 mm | 85 °C | -40 °C | 1 Mbit | |
Winbond Electronics | 3 ms | 3 ms | 104 MHz | FLASH | 8-WSON | SPI | 3.6 V | 2.7 V | FLASH | Non-Volatile | Surface Mount | 128 K | 8 bit | 6 mm | 5 mm | 85 °C | -40 °C | 1 Mbit | 8-WDFN Exposed Pad |
Winbond Electronics | 800 µs | 800 µs | 104 MHz | FLASH | 8-SOIC | SPI | 3.6 V | 2.3 V | FLASH | Non-Volatile | Surface Mount | 128 K | 8 bit | 0.154 in | 3.9 mm | 85 °C | -40 °C | 1 Mbit | |
Winbond Electronics | 3 ms | 3 ms | 75 MHz | FLASH | 8-WSON | SPI | 3.6 V | 2.7 V | FLASH | Non-Volatile | Surface Mount | 128 K | 8 bit | 6 mm | 5 mm | 85 °C | -40 °C | 1 Mbit | 8-WDFN Exposed Pad |
Winbond Electronics | 800 µs | 800 µs | 104 MHz | FLASH | 8-WSON | SPI | 3.6 V | 2.3 V | FLASH | Non-Volatile | Surface Mount | 128 K | 8 bit | 6 mm | 5 mm | 85 °C | -40 °C | 1 Mbit | 8-WDFN Exposed Pad |
Winbond Electronics | 800 µs | 800 µs | 104 MHz | FLASH | 8-SOIC | SPI | 3.6 V | 2.3 V | FLASH | Non-Volatile | Surface Mount | 128 K | 8 bit | 0.154 in | 3.9 mm | 85 °C | -40 °C | 1 Mbit |