Beta
⌘K
PGA GOLD BERYLLIUM COPPER ALLOY -65℃~+125℃ 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS
| Part | Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Current Rating (Amps) | Mounting Type | Pitch - Mating | Pitch - Mating | Contact Material - Mating | Termination | Material Flammability Rating | Contact Material - Post | Termination Post Length | Termination Post Length | Contact Finish - Mating | Operating Temperature [Max] | Operating Temperature [Min] | Features | Pitch - Post | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | PGA ZIF (ZIP) | 200 µin | 5.08 µm | 1 A | Through Hole | 0.1 in | 2.54 mm | Beryllium Copper | Solder | UL94 V-0 | Beryllium Copper | 3.18 mm | 0.125 in | Gold | 125 °C | -65 ░C | Closed Frame | 2.54 mm | 0.1 in | Tin | 30 Áin | 0.76 Ám |