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CONN IC DIP SOCKET 26POS GOLD
| Part | Contact Material - Mating | Contact Finish - Mating | Material Flammability Rating | Operating Temperature [Max] | Operating Temperature [Min] | Current Rating (Amps) | Type | Type | Type | Pitch - Mating | Pitch - Mating | Housing Material | Contact Material - Post [custom] | Contact Finish - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Features | Termination | Termination Post Length | Termination Post Length | Pitch - Post | Pitch - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Beryllium Copper | Gold | UL94 V-0 | 105 ░C | -55 °C | 3 A | DIP | 0.6 in | 15.24 mm | 0.1 in | 2.54 mm | Glass Filled Nylon 4/6 Polyamide (PA46) | Brass | Tin | 200 µin | 5.08 µm | Closed Frame | Solder | 3.56 mm | 0.14 in | 2.54 mm | 0.1 in | 30 Áin | 0.76 Ám |