T2M Series

Catalog

HEADERS & WIRE HOUSINGS HIGH RELIABILITY TIGER EYE(TM) DISCRETE WIRE HEADER

Part	Current Rating	Number of Positions	Number of Positions Loaded	Termination	Shrouding	Contact Finish - Mating	Insulation Color	Contact Shape	Operating Temperature (Max)	Operating Temperature (Min)	Contact Finish Thickness - Mating	Mounting Type	Connector Type	Fastening Type	Features	Insulation Material	Number of Rows	Insulation Height	Row Spacing - Mating	Contact Type	Contact Material	Contact Finish - Post	Style	Pitch - Mating	Contact Length - Post	Overall Contact Length
Samtec Inc. T2M-125-01-L-D-SM-DS	2.6 A 3.8 A	50	All	Solder	Shrouded - 4 Wall	Gold	Black	Square	125 °C	-55 °C	10 µin	Surface Mount	Header	Push-Pull	Mating Flange	Liquid Crystal Polymer (LCP)	2	0.228 in	0.079 in	Male Pin	Phosphor Bronze	Tin	Board Board or Cable	0.079 in
Samtec Inc. T2M-104-01-L-D-SM-WT	2.6 A 3.8 A	8	All	Solder	Shrouded - 4 Wall	Gold	Black	Square	125 °C	-55 °C	10 µin	Surface Mount	Header	Push-Pull	Solder Retention	Liquid Crystal Polymer (LCP)	2	0.228 in	0.079 in	Male Pin	Phosphor Bronze	Tin	Board Board or Cable	0.079 in
Samtec Inc. T2M-110-01-L-D-RA	2.6 A 3.8 A	20	All	Solder	Shrouded - 4 Wall	Gold	Black	Square	125 °C	-55 °C	10 µin	Right Angle Through Hole	Header	Push-Pull		Liquid Crystal Polymer (LCP)	2	0.293 in	0.079 in	Male Pin	Phosphor Bronze	Tin	Board Board or Cable	0.079 in	0.09 in
Samtec Inc. T2M-107-01-S-D-SM-WT-K-TR	2.6 A 3.8 A	14	All	Solder	Shrouded - 4 Wall	Gold	Black	Square	125 °C	-55 °C	30 µin	Surface Mount	Header	Push-Pull	Pick and Place Solder Retention	Liquid Crystal Polymer (LCP)	2	0.228 in	0.079 in	Male Pin	Phosphor Bronze	Tin	Board Board or Cable	0.079 in
Samtec Inc. T2M-106-01-L-D-RA-WT	2.6 A 3.8 A	12	All	Solder	Shrouded - 4 Wall	Gold	Black	Square	125 °C	-55 °C	10 µin	Right Angle Through Hole	Header	Push-Pull	Solder Retention	Liquid Crystal Polymer (LCP)	2	0.293 in	0.079 in	Male Pin	Phosphor Bronze	Tin	Board Board or Cable	0.079 in	0.09 in
Samtec Inc. T2M-114-01-L-D-TH-WT	2.6 A 3.8 A	28	All	Solder	Shrouded - 4 Wall	Gold	Black	Square	125 °C	-55 °C	10 µin	Through Hole	Header	Push-Pull	Solder Retention	Liquid Crystal Polymer (LCP)	2	0.228 in	0.079 in	Male Pin	Phosphor Bronze	Tin	Board Board or Cable	0.079 in	0.117 in	0.302 in
Samtec Inc. T2M-110-01-S-D-RA	2.6 A 3.8 A	20	All	Solder	Shrouded - 4 Wall	Gold	Black	Square	125 °C	-55 °C	30 µin	Right Angle Through Hole	Header	Push-Pull		Liquid Crystal Polymer (LCP)	2	0.293 in	0.079 in	Male Pin	Phosphor Bronze	Tin	Board Board or Cable	0.079 in	0.09 in
Samtec Inc. T2M-105-01-L-D-SM-WT	2.6 A 3.8 A	10	All	Solder	Shrouded - 4 Wall	Gold	Black	Square	125 °C	-55 °C	10 µin	Surface Mount	Header	Push-Pull	Solder Retention	Liquid Crystal Polymer (LCP)	2	0.228 in	0.079 in	Male Pin	Phosphor Bronze	Tin	Board Board or Cable	0.079 in
Samtec Inc. T2M-123-01-L-D-SM-K-TR	2.6 A 3.8 A	46	All	Solder	Shrouded - 4 Wall	Gold	Black	Square	125 °C	-55 °C	10 µin	Surface Mount	Header	Push-Pull	Pick and Place	Liquid Crystal Polymer (LCP)	2	0.228 in	0.079 in	Male Pin	Phosphor Bronze	Tin	Board Board or Cable	0.079 in
Samtec Inc. T2M-115-01-S-D-RA-WT	2.6 A 3.8 A	30	All	Solder	Shrouded - 4 Wall	Gold	Black	Square	125 °C	-55 °C	30 µin	Right Angle Through Hole	Header	Push-Pull	Solder Retention	Liquid Crystal Polymer (LCP)	2	0.293 in	0.079 in	Male Pin	Phosphor Bronze	Tin	Board Board or Cable	0.079 in	0.09 in