IC FPGA 131 I/O 160QFP
| Part | Package / Case | Supplier Device Package | Mounting Type | Number of I/O | Number of Gates [custom] | Operating Temperature [Max] | Operating Temperature [Min] | Number of LABs/CLBs | Voltage - Supply [Min] | Voltage - Supply [Max] | Supplier Device Package [x] | Supplier Device Package [y] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microsemi Corporation | 160-BQFP | 160-PQFP (28x28) | Surface Mount | 131 | 6000 | 85 °C | -40 °C | 848 | 4.5 V | 5.5 V | ||
Microsemi Corporation | 160-BQFP | 160-PQFP (28x28) | Surface Mount | 131 | 6000 | 70 °C | 0 °C | 848 | 4.5 V | 5.5 V | ||
Microsemi Corporation | 208-BFQFP | 208-PQFP (28x28) | Surface Mount | 167 I/O | 6000 | 85 °C | -40 °C | 848 | 4.5 V | 5.5 V | ||
Microsemi Corporation | 160-BQFP | 160-PQFP (28x28) | Surface Mount | 131 | 6000 | 85 °C | -40 °C | 848 | 4.5 V | 5.5 V | ||
Microsemi Corporation | 176-LQFP | 176-TQFP (24x24) | Surface Mount | 151 | 6000 | 85 °C | -40 °C | 848 | 4.5 V | 5.5 V | ||
Microsemi Corporation | 176-LQFP | 176-TQFP (24x24) | Surface Mount | 151 | 6000 | 70 °C | 0 °C | 848 | 4.5 V | 5.5 V | ||
Microsemi Corporation | 207-BCPGA | 207-CPGA (44.96x44.96) | Through Hole | 168 I/O | 6000 | 70 °C | 0 °C | 848 | 4.5 V | 5.5 V | ||
Microsemi Corporation | 176-LQFP | 176-TQFP (24x24) | Surface Mount | 151 | 6000 | 85 °C | -40 °C | 848 | 4.5 V | 5.5 V | ||
Microsemi Corporation | 196-BCQFP with Tie Bar | 196-CQFP | Surface Mount | 168 I/O | 6000 | 70 °C | 0 °C | 848 | 4.5 V | 5.5 V | 63.5 | 63.5 |
Microsemi Corporation | 208-BFQFP | 208-PQFP (28x28) | Surface Mount | 167 I/O | 6000 | 85 °C | -40 °C | 848 | 4.5 V | 5.5 V |