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CONN IC DIP SOCKET 16POS GOLD
| Part | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Mating | Housing Material | Material Flammability Rating | Pitch - Mating | Pitch - Mating | Contact Material - Post [custom] | Mounting Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Termination Post Length | Termination Post Length | Current Rating (Amps) | Pitch - Post | Pitch - Post | Type | Type | Type | Termination | Features | Contact Finish - Mating | Operating Temperature [Max] | Operating Temperature [Min] | Number of Positions or Pins (Grid) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 10 çin | 0.25 çm | Beryllium Copper | Glass Filled Nylon 4/6 Polyamide (PA46) | UL94 V-0 | 0.1 in | 2.54 mm | Brass | Through Hole | 30 Áin | 0.76 Ám | Gold | 3.56 mm | 0.14 in | 3 A | 2.54 mm | 0.1 in | DIP | 0.6 in | 15.24 mm | Solder | Closed Frame Elevated | Gold | 105 ░C | -55 °C | 16 |
Aries Electronics | 10 çin | 0.25 çm | Beryllium Copper | Glass Filled Nylon 4/6 Polyamide (PA46) | UL94 V-0 | 0.1 in | 2.54 mm | Brass | Through Hole | 30 Áin | 0.76 Ám | Gold | 3.56 mm | 0.14 in | 3 A | 2.54 mm | 0.1 in | DIP | 0.3 " | 7.62 mm | Solder | Closed Frame Elevated | Gold | 105 ░C | -55 °C | 16 |