ESQT-117 Series

Catalog

CONN SOCKET 68POS 0.079 GOLD PCB

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Part	Insulation Height [z]	Insulation Height [z]	Contact Finish - Mating	Contact Type	Operating Temperature [Min]	Operating Temperature [Max]	Termination	Current Rating (Amps)	Style	Contact Length - Post	Contact Length - Post	Insulation Material	Contact Finish - Post	Fastening Type	Insulation Color	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Number of Positions Loaded	Contact Material	Mounting Type	Contact Shape	Row Spacing - Mating	Row Spacing - Mating	Number of Positions	Pitch - Mating [x]	Pitch - Mating [x]	Material Flammability Rating	Connector Type	Insulation Height	Insulation Height	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Number of Rows	Contact Length - Post [x]	Contact Length - Post [x]
Samtec Inc. ESQT-117-03-F-Q-345	8.76 mm	0.345 "	Gold	Forked	-55 °C	125 °C	Solder	4.5 A	Board to Board Cable	0.113 in	2.87 mm	Liquid Crystal Polymer (LCP)	Tin	Push-Pull	Black	3 µin	0.076 µm	All	Phosphor Bronze	Through Hole	Square	0.079 in	2 mm	68	0.079 in	2 mm	UL94 V-0	Elevated Socket
Samtec Inc. ESQT-117-02-L-Q-675			Gold	Forked	-55 °C	125 °C	Solder	4.5 A	Board to Board Cable	0.175 in	4.45 mm	Liquid Crystal Polymer (LCP)	Tin	Push-Pull	Black	10 çin	0.25 çm	All	Phosphor Bronze	Through Hole	Square	0.079 in	2 mm	68	0.079 in	2 mm	UL94 V-0	Elevated Socket	0.675 in	17.14 mm
Samtec Inc. ESQT-117-02-G-D-472			Gold	Forked	-55 °C	125 °C	Solder	4.5 A	Board to Board Cable	0.378 "	9.6 mm	Liquid Crystal Polymer (LCP)	Gold	Push-Pull	Black	20 µin	0.51 µm	All	Phosphor Bronze	Through Hole	Square	0.079 in	2 mm	34	0.079 in	2 mm	UL94 V-0	Elevated Socket	0.472 in	12 mm	3 µin	0.076 µm	2
Samtec Inc. ESQT-117-02-LM-D-500			Gold	Forked	-55 °C	125 °C	Solder	4.5 A	Board to Board Cable			Liquid Crystal Polymer (LCP)	Tin	Push-Pull	Black	10 çin	0.25 çm	All	Phosphor Bronze	Through Hole	Square	0.079 in	2 mm	34	0.079 in	2 mm	UL94 V-0	Elevated Socket	0.5 in	12.7 mm			2	8.89 mm	0.35 in
Samtec Inc. ESQT-117-02-GF-D-700			Gold	Forked	-55 °C	125 °C	Solder	4.5 A	Board to Board Cable			Liquid Crystal Polymer (LCP)	Gold	Push-Pull	Black	20 µin	0.51 µm	All	Phosphor Bronze	Through Hole	Square	0.079 in	2 mm	34	0.079 in	2 mm	UL94 V-0	Elevated Socket	0.7 in	17.78 mm	3 µin	0.076 µm	2	3.81 mm	0.15 in
Samtec Inc. ESQT-117-02-G-D-309			Gold	Forked	-55 °C	125 °C	Solder	4.5 A	Board to Board Cable	0.541 in	13.74 mm	Liquid Crystal Polymer (LCP)	Gold	Push-Pull	Black	20 µin	0.51 µm	All	Phosphor Bronze	Through Hole	Square	0.079 in	2 mm	34	0.079 in	2 mm	UL94 V-0	Elevated Socket	0.309 in	7.85 mm	3 µin	0.076 µm	2
Samtec Inc. ESQT-117-02-G-D-545	13.84 mm	0.545 in	Gold	Forked	-55 °C	125 °C	Solder	4.5 A	Board to Board Cable			Liquid Crystal Polymer (LCP)	Gold	Push-Pull	Black	20 µin	0.51 µm	All	Phosphor Bronze	Through Hole	Square	0.079 in	2 mm	34	0.079 in	2 mm	UL94 V-0	Elevated Socket			3 µin	0.076 µm	2
Samtec Inc. ESQT-117-03-G-D-354			Gold	Forked	-55 °C	125 °C	Solder	4.5 A	Board to Board Cable	0.104 in	2.64 mm	Liquid Crystal Polymer (LCP)	Gold	Push-Pull	Black	20 µin	0.51 µm	All	Phosphor Bronze	Through Hole	Square	0.079 in	2 mm	34	0.079 in	2 mm	UL94 V-0	Elevated Socket	0.354 in	9 mm	3 µin	0.076 µm	2
Samtec Inc. ESQT-117-03-F-D-330			Gold	Forked	-55 °C	125 °C	Solder	4.5 A	Board to Board Cable	0.128 "	3.25 mm	Liquid Crystal Polymer (LCP)	Tin	Push-Pull	Black	3 µin	0.076 µm	All	Phosphor Bronze	Through Hole	Square	0.079 in	2 mm	34	0.079 in	2 mm	UL94 V-0	Elevated Socket	0.33 in	8.38 mm			2
Samtec Inc. ESQT-117-02-M-D-730			Gold	Forked	-55 °C	125 °C	Solder	4.5 A	Board to Board Cable			Liquid Crystal Polymer (LCP)	Tin	Push-Pull	Black	20 µin	0.51 µm	All	Phosphor Bronze	Through Hole	Square	0.079 in	2 mm	34	0.079 in	2 mm	UL94 V-0	Elevated Socket	0.73 "	18.54 mm			2	3.05 mm	0.12 in