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IC FPGA 140 I/O 176CPGA
| Part | Number of Gates | Mounting Type | Package / Case | Supplier Device Package | Operating Temperature [Max] | Operating Temperature [Min] | Number of LABs/CLBs | Voltage - Supply [Min] | Voltage - Supply [Max] | Number of I/O | Supplier Device Package [x] | Supplier Device Package [y] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microsemi Corporation | 8000 | Through Hole | 176-BCPGA | 176-CPGA 39.88x39.88 | 125 ¯C | -55 °C | 1232 | 4.5 V | 5.5 V | 140 | ||
Microsemi Corporation | 8000 | Through Hole | 176-BCPGA | 176-CPGA 39.88x39.88 | 125 ¯C | -55 °C | 1232 | 4.5 V | 5.5 V | 140 | ||
Microsemi Corporation | 8000 | Surface Mount | 172-CQFP with Tie Bar | 172-CQFP | 125 °C | -55 °C | 1232 | 4.5 V | 5.5 V | 140 | 63.37 | 63.37 |
Microsemi Corporation | 8000 | Surface Mount | 84-LCC (J-Lead) | 84-PLCC (29.31x29.31) | 85 °C | -40 °C | 1232 | 4.5 V | 5.5 V | 72 | ||
Microsemi Corporation | 8000 | Surface Mount | 176-BCPGA | 176-CPGA 39.88x39.88 | 125 °C | -55 °C | 1232 | 4.5 V | 5.5 V | 140 | ||
Microsemi Corporation | 8000 | Surface Mount | 84-LCC (J-Lead) | 84-PLCC (29.31x29.31) | 70 °C | 0 °C | 1232 | 4.5 V | 5.5 V | 72 | ||
Microsemi Corporation | 8000 | Through Hole | 176-BCPGA | 176-CPGA 39.88x39.88 | 70 °C | 0 °C | 1232 | 4.5 V | 5.5 V | 140 | ||
Microsemi Corporation | 8000 | Surface Mount | 160-BQFP | 160-PQFP (28x28) | 70 °C | 0 °C | 1232 | 4.5 V | 5.5 V | 125 | ||
Microsemi Corporation | 8000 | Surface Mount | 160-BQFP | 160-PQFP (28x28) | 85 °C | -40 °C | 1232 | 4.5 V | 5.5 V | 125 | ||
Microsemi Corporation | 8000 | Surface Mount | 160-BQFP | 160-PQFP (28x28) | 70 °C | 0 °C | 1232 | 4.5 V | 5.5 V | 125 |