36-3553 Series

Catalog

CONN IC DIP SOCKET ZIF 36POS

Part	Mounting Type	Type	Type	Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Mating	Pitch - Mating	Termination Post Length	Termination Post Length	Contact Material - Mating	Material Flammability Rating	Features	Contact Material - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Operating Temperature [Min]	Operating Temperature [Max]	Current Rating (Amps)	Number of Positions or Pins (Grid)	Termination	Contact Finish - Post	Housing Material	Contact Finish - Mating	Pitch - Post	Pitch - Post
Aries Electronics 36-3553-18	Through Hole	7.62 mm	0.3 in	DIP ZIF (ZIP)	1.27 µm	50 µin	0.1 in	2.54 mm	0.11 in	2.78 mm	Beryllium Nickel	UL94 V-0	Closed Frame	Beryllium Nickel	1.27 µm	50 µin	-55 °C	250 °C	1 A	36	Solder	Nickel Boron	Polyetheretherketone (PEEK) Glass Filled	Nickel Boron	2.54 mm	0.1 in
Aries Electronics 36-3553-10	Through Hole	7.62 mm	0.3 in	DIP ZIF (ZIP)	5.08 µm	200 µin	0.1 in	2.54 mm	0.11 in	2.78 mm	Beryllium Copper	UL94 V-0	Closed Frame	Beryllium Copper	5.08 µm	200 µin			1 A	36	Solder	Tin	Polyphenylene Sulfide (PPS) Glass Filled		2.54 mm	0.1 in
Aries Electronics 36-3553-16	Through Hole	7.62 mm	0.3 in	DIP ZIF (ZIP)	1.27 µm	50 µin	0.1 in	2.54 mm	0.11 in	2.78 mm	Beryllium Copper	UL94 V-0	Closed Frame	Beryllium Copper	1.27 µm	50 µin			1 A	36	Solder	Nickel Boron	Polyphenylene Sulfide (PPS) Glass Filled	Nickel Boron	2.54 mm	0.1 in