CONN HEADER SMD R/A 156P 0.8MM
| Part | Connector Type | Current Rating (Amps) | Insulation Color | Number of Positions Loaded | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Mounting Type | Shrouding | Fastening Type | Termination | Material Flammability Rating | Operating Temperature [Min] | Operating Temperature [Max] | Contact Finish - Post | Pitch - Mating | Pitch - Mating | Number of Rows | Contact Material | Insulation Height | Insulation Height | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Row Spacing - Mating | Row Spacing - Mating | Contact Finish - Mating | Insulation Material | Contact Length - Mating [x] | Contact Length - Mating [x] | Contact Shape | Contact Type | Insulation Height [z] | Insulation Height [z] | Features |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Header | 2.7 A | Black | All | 10 çin | 0.25 çm | Surface Mount Right Angle | Unshrouded | Push-Pull | Solder | UL94 V-0 | -55 °C | 125 °C | Gold | 0.031 in | 0.8 mm | 2 | Phosphor Bronze | 3.05 mm | 0.12 in | 3 µin | 0.076 µm | 1.2 mm | 0.047 in | Gold | Liquid Crystal Polymer (LCP) | 1.9 mm | 0.075 in | Square | Male Pin | |||
Samtec Inc. | Header | 2.7 A | Black | All | 10 çin | 0.25 çm | Surface Mount | Unshrouded | Push-Pull | Solder | UL94 V-0 | -55 °C | 125 °C | Gold | 0.031 in | 0.8 mm | 2 | Phosphor Bronze | 1.2 mm | 0.047 in | Gold | Liquid Crystal Polymer (LCP) | 1.9 mm | 0.075 in | Square | Male Pin | 0.055 in | 1.4 mm | Board Guide |