HMTSW-225 Series

Catalog

CONN HEADER VERT 25POS 5.08MM

Part	Current Rating (Amps)	Fastening Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Length - Mating [x]	Contact Length - Mating	Style	Contact Material	Overall Contact Length	Overall Contact Length	Insulation Material	Number of Positions Loaded	Contact Type	Connector Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Post	Operating Temperature [Min]	Operating Temperature [Max]	Insulation Color	Number of Rows	Shrouding	Termination	Mounting Type	Contact Length - Post	Contact Length - Post	Contact Shape	Material Flammability Rating	Contact Finish - Mating	Pitch - Mating	Pitch - Mating	Insulation Height	Insulation Height	Row Spacing - Mating [x]	Row Spacing - Mating [x]	Contact Length - Mating	Number of Positions
Samtec Inc. HMTSW-225-08-G-S-235	3 A	Push-Pull	3 µin	0.076 µm	0.235 in	5.97 mm	Board to Board Cable	Phosphor Bronze	13.46 mm	0.53 in	Liquid Crystal Polymer (LCP)	All	Male Pin	Header	10 çin	0.25 çm	Gold	-55 °C	125 °C	Natural	1	Unshrouded	Solder	Through Hole	0.195 in	4.95 mm	Square	UL94 V-0	Gold	5.08 mm	0.2 in	0.1 in	2.54 mm
Samtec Inc. HMTSW-225-09-S-S-540	3 A	Push-Pull					Board to Board Cable	Phosphor Bronze	18.54 mm	0.73 in	Liquid Crystal Polymer (LCP)	All	Male Pin	Header	30 Áin	0.76 Ám	Tin	-55 °C	125 °C	Natural	1	Unshrouded	Solder	Through Hole	0.09 "	2.29 mm	Square	UL94 V-0	Gold	5.08 mm	0.2 in	0.1 in	2.54 mm
Samtec Inc. HMTSW-225-09-G-D-400	3 A	Push-Pull	3 µin	0.076 µm		10.16 mm	Board to Board Cable	Phosphor Bronze	18.54 mm	0.73 in	Liquid Crystal Polymer (LCP)	All	Male Pin	Header	10 çin	0.25 çm	Gold	-55 °C	125 °C	Natural	2	Unshrouded	Solder	Through Hole	0.23 in	5.84 mm	Square	UL94 V-0	Gold	5.08 mm	0.2 in	0.1 in	2.54 mm	2.54 mm	0.1 in	0.4 in	50