MMT-111 Series

Catalog

3A SURFACE MOUNT TIN 22P -55℃~+105℃ 2MM DOUBLE ROW BLACK PHOSPHOR BRONZE 2MM SMD,P=2MM,SURFACE MOUNT，RIGHT ANGLE PIN HEADERS ROHS

Part	Style	Contact Finish - Post	Termination	Row Spacing - Mating	Row Spacing - Mating	Operating Temperature [Max]	Operating Temperature [Min]	Contact Type	Contact Length - Mating	Contact Length - Mating	Number of Rows	Shrouding	Number of Positions Loaded	Insulation Color	Fastening Type	Material Flammability Rating	Connector Type	Current Rating (Amps)	Insulation Material	Contact Material	Number of Positions	Mounting Type	Insulation Height [custom]	Insulation Height [custom]	Contact Shape	Pitch - Mating [x]	Pitch - Mating [x]	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Insulation Height	Insulation Height	Features
Samtec Inc. MMT-111-01-T-DH	Board to Board Cable	Tin	Solder	0.079 in	2 mm	105 ░C	-55 °C	Male Pin	3.2 mm	0.126 "	2	Unshrouded	All	Black	Push-Pull	UL94 V-0	Header	3 A	Liquid Crystal Polymer (LCP)	Phosphor Bronze	22 positions	Surface Mount Right Angle	0.157 in	4 mm	Square	0.079 in	2 mm
Samtec Inc. MMT-111-01-S-MT	Board to Board Cable	Tin	Solder	0.079 in	2 mm	125 °C	-55 °C	Male Pin	3.2 mm	0.126 "	2	Unshrouded	All	Black	Push-Pull	UL94 V-0	Header	3 A	Liquid Crystal Polymer (LCP)	Phosphor Bronze	22 positions	Surface Mount Right Angle Through Hole	0.157 in	4 mm	Square	0.079 in	2 mm	Gold	30 Áin	0.76 Ám
Samtec Inc. MMT-111-02-T-SH	Board to Board Cable	Tin	Solder			105 ░C	-55 °C	Male Pin	4.45 mm	0.175 in	1	Unshrouded	All	Black	Push-Pull	UL94 V-0	Header	3 A	Liquid Crystal Polymer (LCP)	Phosphor Bronze	11	Surface Mount Right Angle			Square	0.079 in	2 mm				0.079 in	2 mm
Samtec Inc. MMT-111-02-S-DH-P	Board to Board Cable	Tin	Solder	0.079 in	2 mm	125 °C	-55 °C	Male Pin	4.45 mm	0.175 in	2	Unshrouded	All	Black	Push-Pull	UL94 V-0	Header	3 A	Liquid Crystal Polymer (LCP)	Phosphor Bronze	22 positions	Surface Mount Right Angle	0.157 in	4 mm	Square	0.079 in	2 mm	Gold	30 Áin	0.76 Ám			Pick and Place
Samtec Inc. MMT-111-02-F-SH	Board to Board Cable	Tin	Solder			125 °C	-55 °C	Male Pin	4.45 mm	0.175 in	1	Unshrouded	All	Black	Push-Pull	UL94 V-0	Header	3 A	Liquid Crystal Polymer (LCP)	Phosphor Bronze	11	Surface Mount Right Angle			Square	0.079 in	2 mm	Gold	3 µin	0.076 µm	0.079 in	2 mm
Samtec Inc. MMT-111-01-T-DV	Board to Board Cable	Tin	Solder	0.079 in	2 mm	105 ░C	-55 °C	Male Pin	3.2 mm	0.126 "	2	Unshrouded	All	Black	Push-Pull	UL94 V-0	Header	3 A	Liquid Crystal Polymer (LCP)	Phosphor Bronze	22 positions	Surface Mount			Square	0.079 in	2 mm				0.079 in	2 mm
Samtec Inc. MMT-111-01-T-SH	Board to Board Cable	Tin	Solder			105 ░C	-55 °C	Male Pin	3.2 mm	0.126 "	1	Unshrouded	All	Black	Push-Pull	UL94 V-0	Header	3 A	Liquid Crystal Polymer (LCP)	Phosphor Bronze	11	Surface Mount Right Angle			Square	0.079 in	2 mm				0.079 in	2 mm
Samtec Inc. MMT-111-01-S-DH-P	Board to Board Cable	Tin	Solder	0.079 in	2 mm	125 °C	-55 °C	Male Pin	3.2 mm	0.126 "	2	Unshrouded	All	Black	Push-Pull	UL94 V-0	Header	3 A	Liquid Crystal Polymer (LCP)	Phosphor Bronze	22 positions	Surface Mount Right Angle	0.157 in	4 mm	Square	0.079 in	2 mm	Gold	30 Áin	0.76 Ám			Pick and Place
Samtec Inc. MMT-111-01-F-DH	Board to Board Cable	Tin	Solder	0.079 in	2 mm	125 °C	-55 °C	Male Pin	3.2 mm	0.126 "	2	Unshrouded	All	Black	Push-Pull	UL94 V-0	Header	3 A	Liquid Crystal Polymer (LCP)	Phosphor Bronze	22 positions	Surface Mount Right Angle	0.157 in	4 mm	Square	0.079 in	2 mm	Gold	3 µin	0.076 µm
Samtec Inc. MMT-111-01-T-SH-K-TR	Board to Board Cable	Tin	Solder			105 ░C	-55 °C	Male Pin	3.2 mm	0.126 "	1	Unshrouded	All	Black	Push-Pull	UL94 V-0	Header	3 A	Liquid Crystal Polymer (LCP)	Phosphor Bronze	11	Surface Mount Right Angle			Square	0.079 in	2 mm				0.079 in	2 mm	Pick and Place