MC33FS6502 Series
Manufacturer: NXP USA Inc.
SYSTEM BASIS CHIP, DCDC 0.8A VCORE LDT, LQFP48EP/ REEL ROHS COMPLIANT: YES
| Part | Package / Case | Applications | Package Length | Package Name | Package Width | Mounting Type | Operating Temperature (Max) | Operating Temperature (Min) | Voltage - Supply (Minimum) | Voltage - Supply (Maximum) |
|---|---|---|---|---|---|---|---|---|---|---|
NXP USA Inc. | 48-LQFP Exposed Pad | System Basis Chip | 7 mm | 48-HLQFP | 7 mm | Surface Mount | 125 °C | -40 °C | 1 V | 5 V |
NXP USA Inc. | 48-LQFP Exposed Pad | System Basis Chip | 7 mm | 48-HLQFP | 7 mm | Surface Mount | 125 °C | -40 °C | 1 V | 5 V |
NXP USA Inc. | 48-LQFP Exposed Pad | System Basis Chip | 7 mm | 48-HLQFP | 7 mm | Surface Mount | 125 °C | -40 °C | 1 V | 5 V |
NXP USA Inc. | 48-LQFP Exposed Pad | System Basis Chip | 7 mm | 48-HLQFP | 7 mm | Surface Mount | 125 °C | -40 °C | 1 V | 5 V |