23-0513 Series

Catalog

CONN SOCKET SIP 23POS GOLD

Part	Termination	Contact Finish - Post	Pitch - Post	Pitch - Post	Contact Finish - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Material Flammability Rating	Housing Material	Type	Termination Post Length	Termination Post Length	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Pitch - Mating	Pitch - Mating	Contact Material - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Mounting Type	Contact Material - Post [custom]	Current Rating (Amps)
Aries Electronics 23-0513-10	Solder	Tin	2.54 mm	0.1 in	Gold	200 µin	5.08 µm	UL94 V-0	Glass Filled Nylon 4/6 Polyamide (PA46)	SIP	3.18 mm	0.125 in	1 x 23	23	0.1 in	2.54 mm	Beryllium Copper	10 çin	0.25 çm	Through Hole	Brass	3 A
Aries Electronics 23-0513-11	Solder	Gold	2.54 mm	0.1 in	Gold	10 çin	0.25 çm	UL94 V-0	Glass Filled Nylon 4/6 Polyamide (PA46)	SIP	3.18 mm	0.125 in	1 x 23	23	0.1 in	2.54 mm	Beryllium Copper	10 çin	0.25 çm	Through Hole	Brass	3 A
Aries Electronics 23-0513-11H	Solder	Gold	2.54 mm	0.1 in	Gold	10 çin	0.25 çm	UL94 V-0	Glass Filled Nylon 4/6 Polyamide (PA46)	SIP	3.18 mm	0.125 in	1 x 23	23	0.1 in	2.54 mm	Beryllium Copper	10 çin	0.25 çm	Through Hole	Brass	3 A
Aries Electronics 23-0513-10H	Solder	Tin	2.54 mm	0.1 in	Gold	200 µin	5.08 µm	UL94 V-0	Glass Filled Nylon 4/6 Polyamide (PA46)	SIP	3.18 mm	0.125 in	1 x 23	23	0.1 in	2.54 mm	Beryllium Copper	10 çin	0.25 çm	Through Hole	Brass	3 A
Aries Electronics 23-0513-10T	Solder	Tin	2.54 mm	0.1 in	Gold	200 µin	5.08 µm	UL94 V-0	Glass Filled Nylon 4/6 Polyamide (PA46)	SIP	3.18 mm	0.125 in	1 x 23	23	0.1 in	2.54 mm	Beryllium Copper	10 çin	0.25 çm	Through Hole	Brass	3 A