42-6574 Series

Catalog

CONN IC DIP SOCKET ZIF 42POS TIN

Part	Material Flammability Rating	Termination Post Length	Current Rating	Contact Finish - Mating	Pitch - Mating	Row Spacing	Type	Mounting Type	Pitch - Post	Housing Material	Termination	Contact Material - Mating	Contact Material - Post	Contact Finish - Post	Contact Finish Thickness - Post	Number of Positions or Pins (Grid)	Grid Columns	Grid Rows	Features	Contact Finish Thickness - Mating
Aries Electronics 42-6574-16	UL94 V-0	0.11 in	1 A	Tin	0.1 in	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	Through Hole	0.1 in	Glass Filled Polyphenylene Sulfide PPS	Solder	Beryllium Copper	Beryllium Copper	Tin	200 µin	42	21	2	Closed Frame	200 Ąin
Aries Electronics 42-6574-10	UL94 V-0	0.11 in	1 A	Tin	0.1 in	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	Through Hole	0.1 in	Glass Filled Polyphenylene Sulfide PPS	Solder	Beryllium Copper	Beryllium Copper	Tin	200 µin	42	21	2	Closed Frame	200 Ąin
Aries Electronics 42-6574-18	UL94 V-0	0.11 in	1 A	Tin	0.1 in	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	Through Hole	0.1 in	Glass Filled Polyphenylene Sulfide PPS	Solder	Beryllium Copper	Beryllium Copper	Tin	200 µin	42	21	2	Closed Frame	200 Ąin
Aries Electronics 42-6574-11	UL94 V-0	0.11 in	1 A	Tin	0.1 in	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	Through Hole	0.1 in	Glass Filled Polyphenylene Sulfide PPS	Solder	Beryllium Copper	Beryllium Copper	Tin	200 µin	42	21	2	Closed Frame	200 Ąin