40-6574 Series

Catalog

CONN IC DIP SOCKET ZIF 40POS TIN

Part	Contact Material - Post	Pitch - Post	Contact Finish - Mating	Termination	Pitch - Mating	Housing Material	Contact Finish - Post	Mounting Type	Features	Contact Material - Mating	Contact Finish Thickness - Mating	Row Spacing	Type	Contact Finish Thickness - Post	Grid Columns	Number of Positions or Pins (Grid)	Grid Rows	Termination Post Length	Material Flammability Rating	Current Rating
Aries Electronics 40-6574-10	Beryllium Copper	0.1 in	Tin	Solder	0.1 in	Glass Filled Polyphenylene Sulfide PPS	Tin	Through Hole	Closed Frame	Beryllium Copper	200 Ąin	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	200 µin	20	40	2	0.11 in	UL94 V-0	1 A
Aries Electronics 40-6574-11	Beryllium Copper	0.1 in	Tin	Solder	0.1 in	Glass Filled Polyphenylene Sulfide PPS	Tin	Through Hole	Closed Frame	Beryllium Copper	200 Ąin	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	200 µin	20	40	2	0.11 in	UL94 V-0	1 A
Aries Electronics 40-6574-16	Beryllium Copper	0.1 in	Tin	Solder	0.1 in	Glass Filled Polyphenylene Sulfide PPS	Tin	Through Hole	Closed Frame	Beryllium Copper	200 Ąin	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	200 µin	20	40	2	0.11 in	UL94 V-0	1 A