40-6574 Series

Catalog

CONN IC DIP SOCKET ZIF 40POS TIN

Part	Termination	Contact Material - Post	Pitch - Mating	Pitch - Mating	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Contact Material - Mating	Features	Type	Type	Type	Current Rating (Amps)	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Material Flammability Rating	Contact Finish - Post	Pitch - Post	Pitch - Post	Termination Post Length	Termination Post Length	Housing Material	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Mounting Type
Aries Electronics 40-6574-10	Solder	Beryllium Copper	0.1 in	2.54 mm	40	20	2	Beryllium Copper	Closed Frame	15.24 mm	DIP ZIF (ZIP)	0.6 "	1 A	200 µin	5.08 µm	UL94 V-0	Tin	2.54 mm	0.1 in	0.11 in	2.78 mm	Polyphenylene Sulfide (PPS) Glass Filled	5.08 µm	200 µin	Through Hole
Aries Electronics 40-6574-11	Solder	Beryllium Copper	0.1 in	2.54 mm	40	20	2	Beryllium Copper	Closed Frame	15.24 mm	DIP ZIF (ZIP)	0.6 "	1 A	200 µin	5.08 µm	UL94 V-0	Tin	2.54 mm	0.1 in	0.11 in	2.78 mm	Polyphenylene Sulfide (PPS) Glass Filled	5.08 µm	200 µin	Through Hole
Aries Electronics 40-6574-16	Solder	Beryllium Copper	0.1 in	2.54 mm	40	20	2	Beryllium Copper	Closed Frame	15.24 mm	DIP ZIF (ZIP)	0.6 "	1 A	200 µin	5.08 µm	UL94 V-0	Tin	2.54 mm	0.1 in	0.11 in	2.78 mm	Polyphenylene Sulfide (PPS) Glass Filled	5.08 µm	200 µin	Through Hole