TFM-121 Series

Catalog

CONN HEADER SMD 42POS 1.27MM

Part	Number of Positions Loaded	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Mating	Style	Insulation Material	Termination	Current Rating (Amps)	Mounting Type	Fastening Type	Connector Type	Row Spacing - Mating	Row Spacing - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Contact Shape	Number of Rows	Material Flammability Rating	Number of Positions	Voltage Rating	Contact Material	Pitch - Mating	Pitch - Mating	Contact Length - Mating	Contact Length - Mating	Shrouding	Features	Insulation Color	Contact Finish - Post	Contact Type	Insulation Height	Insulation Height
Samtec Inc. TFM-121-02-S-D-P-TR	All	30 Áin	0.76 Ám	Gold	Board to Board Cable	Liquid Crystal Polymer (LCP)	Solder	2.9 A	Surface Mount	Push-Pull	Header	0.05 in	1.27 mm	-55 °C	125 °C	Square	2	UL94 V-0	42	275 VAC	Phosphor Bronze	0.05 in	1.27 mm	3.33 mm	0.131 in	Shrouded - 4 Wall	Pick and Place	Black	Tin	Male Pin	5.6 mm	0.22 in
Samtec Inc. TFM-121-02-S-D-A-K	All	30 Áin	0.76 Ám	Gold	Board to Board Cable	Liquid Crystal Polymer (LCP)	Solder	2.9 A	Surface Mount	Push-Pull	Header	0.05 in	1.27 mm	-55 °C	125 °C	Square	2	UL94 V-0	42	275 VAC	Phosphor Bronze	0.05 in	1.27 mm	3.33 mm	0.131 in	Shrouded - 4 Wall	Board Guide Pick and Place	Black	Tin	Male Pin	5.6 mm	0.22 in
Samtec Inc. TFM-121-02-S-D-A	All	30 Áin	0.76 Ám	Gold	Board to Board Cable	Liquid Crystal Polymer (LCP)	Solder	2.9 A	Surface Mount	Push-Pull	Header	0.05 in	1.27 mm	-55 °C	125 °C	Square	2	UL94 V-0	42	275 VAC	Phosphor Bronze	0.05 in	1.27 mm	3.33 mm	0.131 in	Shrouded - 4 Wall	Board Guide	Black	Tin	Male Pin	5.6 mm	0.22 in
Samtec Inc. TFM-121-02-L-D-A	All	15 µin	0.38 µm	Gold	Board to Board Cable	Liquid Crystal Polymer (LCP)	Solder	2.9 A	Surface Mount	Push-Pull	Header	0.05 in	1.27 mm	-55 °C	125 °C	Square	2	UL94 V-0	42	275 VAC	Phosphor Bronze	0.05 in	1.27 mm	3.33 mm	0.131 in	Shrouded - 4 Wall	Board Guide	Black	Tin	Male Pin	5.6 mm	0.22 in