22-4508 Series

Catalog

CONN IC DIP SOCKET 22POS GOLD

Part	Housing Material	Contact Finish - Mating	Contact Finish - Post	Material Flammability Rating	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid)	Termination	Pitch - Post	Pitch - Post	Operating Temperature [Max]	Operating Temperature [Min]	Current Rating (Amps)	Contact Material - Post [custom]	Termination Post Length	Termination Post Length	Type	Type	Type	Contact Material - Mating	Features	Mounting Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Termination Post Length [x]	Termination Post Length [x]
Aries Electronics 22-4508-30	Glass Filled Nylon 4/6 Polyamide (PA46)	Gold	Tin	UL94 V-0	0.1 in	2.54 mm	30 Áin	0.76 Ám	22	Wire Wrap	2.54 mm	0.1 in	105 ░C	-55 °C	3 A	Brass	0.5 in	12.7 mm	0.4 in	10.16 mm	DIP	Beryllium Copper	Open Frame	Through Hole	200 µin	5.08 µm
Aries Electronics 22-4508-21	Glass Filled Nylon 4/6 Polyamide (PA46)	Gold	Gold	UL94 V-0	0.1 in	2.54 mm	30 Áin	0.76 Ám	22	Wire Wrap	2.54 mm	0.1 in	125 °C	-55 °C	3 A	Brass			0.4 in	10.16 mm	DIP	Beryllium Copper	Open Frame	Through Hole	10 çin	0.25 çm	0.36 in	9.14 mm
Aries Electronics 22-4508-20	Glass Filled Nylon 4/6 Polyamide (PA46)	Gold	Tin	UL94 V-0	0.1 in	2.54 mm	30 Áin	0.76 Ám	22	Wire Wrap	2.54 mm	0.1 in	105 ░C	-55 °C	3 A	Brass			0.4 in	10.16 mm	DIP	Beryllium Copper	Open Frame	Through Hole	200 µin	5.08 µm	0.36 in	9.14 mm