TMM-139 Series

Catalog

CONN HEADER VERT 39POS 2MM

Part	Contact Finish - Mating	Termination	Number of Positions	Contact Finish - Post	Contact Material	Number of Positions Loaded	Shrouding	Contact Type	Pitch - Mating	Contact Length - Mating	Fastening Type	Contact Length - Post	Mounting Type	Insulation Material	Style	Current Rating (Per Contact)	Insulation Color	Contact Shape	Contact Finish Thickness - Mating	Insulation Height	Overall Contact Length	Operating Temperature (Max)	Operating Temperature (Min)	Connector Type	Number of Rows	Row Spacing - Mating	Contact Finish Thickness - Post	Material Flammability Rating
Samtec Inc. TMM-139-01-S-S	Gold	Solder	39	Tin	Phosphor Bronze	All	Unshrouded	Male Pin	0.079 in	0.126 in	Push-Pull	0.138 in	Through Hole	Liquid Crystal Polymer (LCP)	Board Board or Cable	3.2 A	Black	Square	30 µin	0.059 in	0.323 in	125 °C	-55 °C	Header	1
Samtec Inc. TMM-139-01-L-D	Gold	Solder	78	Tin	Phosphor Bronze	All	Unshrouded	Male Pin	0.079 in	0.126 in	Push-Pull	0.138 in	Through Hole	Liquid Crystal Polymer (LCP)	Board Board or Cable	3.2 A	Black	Square	10 µin	0.059 in	0.323 in	125 °C	-55 °C	Header	2	0.079 in
Samtec Inc. TMM-139-01-S-D	Gold	Solder	78	Tin	Phosphor Bronze	All	Unshrouded	Male Pin	0.079 in	0.126 in	Push-Pull	0.138 in	Through Hole	Liquid Crystal Polymer (LCP)	Board Board or Cable	3.2 A	Black	Square	30 µin	0.059 in	0.323 in	125 °C	-55 °C	Header	2	0.079 in
Samtec Inc. TMM-139-01-G-S	Gold	Solder	39	Gold	Phosphor Bronze	All	Unshrouded	Male Pin	0.079 in	0.126 in	Push-Pull	0.138 in	Through Hole	Liquid Crystal Polymer (LCP)	Board Board or Cable	3.2 A	Black	Square	20 Ąin	0.059 in	0.323 in	125 °C	-55 °C	Header	1		3 µin
Samtec Inc. TMM-139-03-S-Q	Gold	Solder	156	Tin	Phosphor Bronze	All	Unshrouded	Male Pin	0.079 in	0.157 in	Push-Pull	0.106 in	Through Hole	Liquid Crystal Polymer (LCP)	Board Board or Cable	3.2 A	Black	Square	30 µin	0.059 in	0.323 in	125 °C	-55 °C	Header	4	0.079 in
Samtec Inc. TMM-139-01-T-S	Tin	Solder	39	Tin	Phosphor Bronze	All	Unshrouded	Male Pin	0.079 in	0.126 in	Push-Pull	0.138 in	Through Hole	Liquid Crystal Polymer (LCP)	Board Board or Cable	3.2 A	Black	Square		0.059 in	0.323 in	105 °C	-55 °C	Header	1
Samtec Inc. TMM-139-01-T-S-SM	Tin	Solder	39	Tin	Phosphor Bronze	All	Unshrouded	Male Pin	0.079 in	0.126 in	Push-Pull		Surface Mount	Liquid Crystal Polymer (LCP)	Board Board or Cable	3.2 A	Black	Square		0.059 in		105 °C	-55 °C	Header	1			UL94 V-0
Samtec Inc. TMM-139-01-G-S-SM	Gold	Solder	39	Gold	Phosphor Bronze	All	Unshrouded	Male Pin	0.079 in	0.126 in	Push-Pull		Surface Mount	Liquid Crystal Polymer (LCP)	Board Board or Cable	3.2 A	Black	Square	20 Ąin	0.059 in		125 °C	-55 °C	Header	1		3 µin	UL94 V-0
Samtec Inc. TMM-139-01-S-Q-RA	Gold	Solder	156	Tin	Phosphor Bronze	All	Unshrouded	Male Pin	0.079 in	0.126 in	Push-Pull	0.12 in	Right Angle Through Hole	Liquid Crystal Polymer (LCP)	Board Board or Cable	3.2 A	Black	Square	30 µin	0.315 in		125 °C	-55 °C	Header	4	0.079 in
Samtec Inc. TMM-139-01-T-D-SM	Tin	Solder	78	Tin	Phosphor Bronze	All	Unshrouded	Male Pin	0.079 in	0.126 in	Push-Pull		Surface Mount	Liquid Crystal Polymer (LCP)	Board Board or Cable	3.2 A	Black	Square		0.059 in		105 °C	-55 °C	Header	2	0.079 in		UL94 V-0