ESQT-128 Series

Catalog

CONN SOCKET 56POS 0.079 GOLD PCB

Part	Pitch - Mating [x]	Pitch - Mating [x]	Insulation Height	Insulation Height	Number of Positions Loaded	Connector Type	Number of Positions	Contact Finish - Mating	Insulation Color	Contact Finish - Post	Termination	Operating Temperature [Min]	Operating Temperature [Max]	Contact Material	Fastening Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Row Spacing - Mating	Row Spacing - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Number of Rows	Contact Shape	Style	Contact Type	Current Rating (Amps)	Contact Length - Post [x]	Contact Length - Post [x]	Mounting Type	Material Flammability Rating	Insulation Material	Contact Length - Post	Contact Length - Post	Number of Positions Loaded
Samtec Inc. ESQT-128-02-G-D-500	0.079 in	2 mm	0.5 in	12.7 mm	All	Elevated Socket	56	Gold	Black	Gold	Solder	-55 °C	125 °C	Phosphor Bronze	Push-Pull	0.51 µm	20 µin	0.079 in	2 mm	3 µin	0.076 µm	2	Square	Board to Board Cable	Forked	4.5 A	8.89 mm	0.35 in	Through Hole	UL94 V-0	Liquid Crystal Polymer (LCP)
Samtec Inc. ESQT-128-02-L-Q-410	0.079 in	2 mm			All	Elevated Socket	112	Gold	Black	Tin	Solder	-55 °C	125 °C	Phosphor Bronze	Push-Pull	0.25 çm	10 çin	0.079 in	2 mm				Square	Board to Board Cable	Forked	4.5 A			Through Hole	UL94 V-0	Liquid Crystal Polymer (LCP)	0.44 in	11.18 mm
Samtec Inc. ESQT-128-03-G-D-368	0.079 in	2 mm	0.368 in	9.35 mm	All	Elevated Socket	56	Gold	Black	Gold	Solder	-55 °C	125 °C	Phosphor Bronze	Push-Pull	0.51 µm	20 µin	0.079 in	2 mm	3 µin	0.076 µm	2	Square	Board to Board Cable	Forked	4.5 A			Through Hole	UL94 V-0	Liquid Crystal Polymer (LCP)	0.09 "	2.29 mm
Samtec Inc. ESQT-128-03-F-D-380	0.079 in	2 mm	0.38 in	9.65 mm	All	Elevated Socket	56	Gold	Black	Tin	Solder	-55 °C	125 °C	Phosphor Bronze	Push-Pull	0.076 µm	3 µin	0.079 in	2 mm			2	Square	Board to Board Cable	Forked	4.5 A	1.98 mm	0.078 in	Through Hole	UL94 V-0	Liquid Crystal Polymer (LCP)
Samtec Inc. ESQT-128-02-F-D-440	0.079 in	2 mm	0.44 in	11.18 mm	All	Elevated Socket	56	Gold	Black	Tin	Solder	-55 °C	125 °C	Phosphor Bronze	Push-Pull	0.076 µm	3 µin	0.079 in	2 mm			2	Square	Board to Board Cable	Forked	4.5 A			Through Hole	UL94 V-0	Liquid Crystal Polymer (LCP)
Samtec Inc. ESQT-128-03-L-D-325-055	0.079 in	2 mm	0.325 in	8.25 mm		Elevated Socket	56	Gold	Black	Tin	Solder	-55 °C	125 °C	Phosphor Bronze	Push-Pull	0.25 çm	10 çin	0.079 in	2 mm			2	Square	Board to Board Cable	Forked	4.5 A			Through Hole	UL94 V-0	Liquid Crystal Polymer (LCP)	0.133 in	3.38 mm	55
Samtec Inc. ESQT-128-03-F-D-387	0.079 in	2 mm			All	Elevated Socket	56	Gold	Black	Tin	Solder	-55 °C	125 °C	Phosphor Bronze	Push-Pull	0.076 µm	3 µin	0.079 in	2 mm			2	Square	Board to Board Cable	Forked	4.5 A	1.8 mm	0.071 "	Through Hole	UL94 V-0	Liquid Crystal Polymer (LCP)
Samtec Inc. ESQT-128-02-G-D-309	0.079 in	2 mm	0.309 in	7.85 mm	All	Elevated Socket	56	Gold	Black	Gold	Solder	-55 °C	125 °C	Phosphor Bronze	Push-Pull	0.51 µm	20 µin	0.079 in	2 mm	3 µin	0.076 µm	2	Square	Board to Board Cable	Forked	4.5 A			Through Hole	UL94 V-0	Liquid Crystal Polymer (LCP)	0.541 in	13.74 mm
Samtec Inc. ESQT-128-03-L-D-310	0.079 in	2 mm	0.31 in	7.87 mm	All	Elevated Socket	56	Gold	Black	Tin	Solder	-55 °C	125 °C	Phosphor Bronze	Push-Pull	0.25 çm	10 çin	0.079 in	2 mm			2	Square	Board to Board Cable	Forked	4.5 A			Through Hole	UL94 V-0	Liquid Crystal Polymer (LCP)	0.148 in	3.76 mm
Samtec Inc. ESQT-128-03-L-D-375-055	0.079 in	2 mm	0.375 in	9.53 mm		Elevated Socket	56	Gold	Black	Tin	Solder	-55 °C	125 °C	Phosphor Bronze	Push-Pull	0.25 çm	10 çin	0.079 in	2 mm			2	Square	Board to Board Cable	Forked	4.5 A			Through Hole	UL94 V-0	Liquid Crystal Polymer (LCP)	0.083 in	2.11 mm	55