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CONN IC DIP SOCKET 30POS GOLD
| Part | Housing Material | Contact Material - Mating | Termination | Type | Type | Type | Contact Finish - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Pitch - Post | Pitch - Post | Material Flammability Rating | Contact Finish - Mating | Pitch - Mating | Pitch - Mating | Contact Material - Post [custom] | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Current Rating (Amps) | Termination Post Length | Termination Post Length | Features | Number of Positions or Pins (Grid) | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Operating Temperature [Max] | Operating Temperature [Min] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Glass Filled Nylon 4/6 Polyamide (PA46) | Beryllium Copper | Solder | DIP | 0.6 in | 15.24 mm | Tin | 200 µin | 5.08 µm | 2.54 mm | 0.1 in | UL94 V-0 | Gold | 0.1 in | 2.54 mm | Brass | 30 Áin | 0.76 Ám | 3 A | 3.56 mm | 0.14 in | Closed Frame | 30 | 2 | 15 | 105 ░C | -55 °C |