FX11LB Series
Manufacturer: Hirose Electric Co Ltd
CONN RCPT 80POS SMD GOLD
| Part | Mounting Type | Features | Height Above Board | Number of Positions | Contact Finish Thickness | Pitch | Connector Type | Number of Rows | Contact Finish | Mated Stacking Height |
|---|---|---|---|---|---|---|---|---|---|---|
Hirose Electric Co Ltd | Surface Mount | Ground Plate Solder Retention | 0.065 in | 80 | 4 µin | 0.02 in | Center Strip Contacts Receptacle | 2 | Gold | 2 mm |
Hirose Electric Co Ltd | Surface Mount | Ground Plate Solder Retention | 0.064 in | 120 | 4 µin | 0.02 in | Header Outer Shroud Contacts | 2 | Gold | 2 mm |
Hirose Electric Co Ltd | Surface Mount | Solder Retention | 0.065 in | 140 | 4 µin | 0.02 in | Center Strip Contacts Receptacle | 2 | Gold | 2 mm |
Hirose Electric Co Ltd | Surface Mount | Ground Plate Solder Retention | 0.064 in | 80 | 4 µin | 0.02 in | Header Outer Shroud Contacts | 2 | Gold | 2 mm |
Hirose Electric Co Ltd | Surface Mount | Solder Retention | 0.065 in | 68 | 4 µin | 0.02 in | Center Strip Contacts Receptacle | 2 | Gold | 2 mm |
Hirose Electric Co Ltd | Surface Mount | Ground Plate Solder Retention | 0.065 in | 60 | 4 µin | 0.02 in | Center Strip Contacts Receptacle | 2 | Gold | 2 mm |
Hirose Electric Co Ltd | Surface Mount | Solder Retention | 0.065 in | 116 | 4 µin | 0.02 in | Center Strip Contacts Receptacle | 2 | Gold | 2 mm |
Hirose Electric Co Ltd | Surface Mount | Solder Retention | 0.065 in | 140 | 4 µin | 0.02 in | Center Strip Contacts Receptacle | 2 | Gold | 2 mm |
Hirose Electric Co Ltd | Surface Mount | Solder Retention | 0.064 in | 116 | 4 µin | 0.02 in | Header Outer Shroud Contacts | 2 | Gold | 2 mm |
Hirose Electric Co Ltd | Surface Mount | Solder Retention | 0.075 in | 116 | 4 µin | 0.02 in | Header Outer Shroud Contacts | 2 | Gold | 2 mm |