CONN SOCKET PGA ZIF GOLD
| Part | Features | Pitch - Post | Pitch - Post | Current Rating (Amps) | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Mating | Contact Material - Post | Contact Finish - Mating | Contact Finish - Post | Operating Temperature [Max] | Operating Temperature [Min] | Type | Termination Post Length | Termination Post Length | Mounting Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Pitch - Mating | Pitch - Mating | Termination | Material Flammability Rating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Closed Frame | 2.54 mm | 0.1 in | 1 A | 200 µin | 5.08 µm | Beryllium Copper | Beryllium Copper | Gold | Tin | 125 °C | -65 ░C | PGA ZIF (ZIP) | 3.18 mm | 0.125 in | Through Hole | 30 Áin | 0.76 Ám | 0.1 in | 2.54 mm | Solder | UL94 V-0 |
Aries Electronics | Closed Frame | 2.54 mm | 0.1 in | 1 A | 200 µin | 5.08 µm | Beryllium Copper | Beryllium Copper | Gold | Tin | 125 °C | -65 ░C | PGA ZIF (ZIP) | 3.18 mm | 0.125 in | Through Hole | 30 Áin | 0.76 Ám | 0.1 in | 2.54 mm | Solder | UL94 V-0 |
Aries Electronics | Closed Frame | 2.54 mm | 0.1 in | 1 A | 200 µin | 5.08 µm | Beryllium Copper | Beryllium Copper | Gold | Tin | 125 °C | -65 ░C | PGA ZIF (ZIP) | 3.18 mm | 0.125 in | Through Hole | 30 Áin | 0.76 Ám | 0.1 in | 2.54 mm | Solder | UL94 V-0 |