
MCP608 Series
Manufacturer: Microchip Technology
2.5V TO 6.0V MICROPOWER CMOS OP AMP
| Part | Current - Supply | Output Type | Voltage - Supply Span (Max) | Package Length | Package Name | Package Width | Number of Circuits | Amplifier Type | Mounting Type | Current - Input Bias | Voltage - Supply Span (Min) | Operating Temperature (Min) | Operating Temperature (Max) | Current - Output / Channel | Slew Rate | Gain Bandwidth Product | Voltage - Input Offset |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology | 18.7 µA | Rail-to-Rail | 6 V | 0.154 in | 8-SOIC | 3.9 mm | 1 | General Purpose | Surface Mount | 1 pA | 2.5 V | -40 °C | 85 °C | 17 mA | 80 mV/µs | 155 kHz | 250 µV |
Microchip Technology | 18.7 µA | Rail-to-Rail | 6 V | 0.154 in | 8-SOIC | 3.9 mm | 1 | General Purpose | Surface Mount | 1 pA | 2.5 V | -40 °C | 85 °C | 17 mA | 80 mV/µs | 155 kHz | 250 µV |
Microchip Technology | 18.7 µA | Rail-to-Rail | 6 V | 0.173 in | 8-TSSOP | 4.4 mm | 1 | General Purpose | Surface Mount | 1 pA | 2.5 V | -40 °C | 85 °C | 17 mA | 80 mV/µs | 155 kHz | 250 µV |
Microchip Technology | 18.7 µA | Rail-to-Rail | 6 V | 0.3 in | 8-DIP 8-PDIP | 7.62 mm | 1 | General Purpose | Through Hole | 1 pA | 2.5 V | -40 °C | 85 °C | 17 mA | 80 mV/µs | 155 kHz | 250 µV |
Microchip Technology | 18.7 µA | Rail-to-Rail | 6 V | 0.173 in | 8-TSSOP | 4.4 mm | 1 | General Purpose | Surface Mount | 1 pA | 2.5 V | -40 °C | 85 °C | 17 mA | 80 mV/µs | 155 kHz | 250 µV |