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CONN IC DIP SOCKET ZIF 36POS TIN
| Part | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Pitch - Post | Pitch - Post | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Pitch - Mating | Mounting Type | Type | Type | Type | Contact Finish - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Termination | Current Rating (Amps) | Contact Material - Post | Features | Contact Material - Mating | Termination Post Length | Termination Post Length | Material Flammability Rating | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Contact Finish - Mating | Operating Temperature [Min] | Operating Temperature [Max] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 5.08 µm | 200 µin | 2.54 mm | 0.1 in | Polyphenylene Sulfide (PPS) Glass Filled | 36 | 0.1 in | 2.54 mm | Through Hole | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | Tin | 200 µin | 5.08 µm | Solder | 1 A | Beryllium Copper | Closed Frame | Beryllium Copper | 0.11 in | 2.78 mm | UL94 V-0 | |||||
Aries Electronics | 1.27 µm | 50 µin | 2.54 mm | 0.1 in | Polyetheretherketone (PEEK) Glass Filled | 0.1 in | 2.54 mm | Through Hole | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | Nickel Boron | 50 µin | 1.27 µm | Solder | 1 A | Beryllium Nickel | Closed Frame | Beryllium Nickel | 0.11 in | 2.78 mm | UL94 V-0 | 2 x 16 | 32 | Nickel Boron | -55 °C | 250 °C |