32-6553 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN IC DIP SOCKET ZIF 36POS TIN
| Part | Current Rating | Termination Post Length | Material Flammability Rating | Contact Finish - Mating | Contact Material - Mating | Termination | Contact Finish - Post | Contact Finish Thickness - Mating | Pitch - Post | Grid Rows | Grid Columns | Number of Positions or Pins (Grid) | Mounting Type | Pitch - Mating | Contact Material - Post | Housing Material | Features | Row Spacing | Type | Contact Finish Thickness - Post | Operating Temperature (Max) | Operating Temperature (Min) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 1 A | 0.11 in | UL94 V-0 | Tin | Beryllium Copper | Solder | Tin | 200 Ąin | 0.1 in | 2 | 18 | 36 | Through Hole | 0.1 in | Beryllium Copper | Glass Filled Polyphenylene Sulfide PPS | Closed Frame | 0.6 in | 0.6" (15.24mm) Row Spacing DIP ZIF (ZIP) | 200 µin | ||
Aries Electronics | 1 A | 0.11 in | UL94 V-0 | Boron Nickel | Beryllium Nickel | Solder | Nickel Boron | 50 µin | 0.1 in | 2 | 16 | 32 | Through Hole | 0.1 in | Beryllium Nickel | Glass Filled PEEK Polyetheretherketone | Closed Frame | 0.6 in | 0.6" (15.24mm) Row Spacing DIP ZIF (ZIP) | 50 µin | 250 °C | -55 °C |