ESW-128 Series

Catalog

CONN SOCKET 56POS 0.1 GOLD PCB

Part	Contact Finish - Post	Mounting Type	Pitch - Mating	Pitch - Mating	Contact Type	Insulation Material	Connector Type	Number of Positions Loaded	Fastening Type	Operating Temperature [Min]	Operating Temperature [Max]	Termination	Insulation Color	Material Flammability Rating	Insulation Height	Insulation Height	Voltage Rating	Number of Rows	Contact Shape	Number of Positions	Contact Material	Contact Length - Post	Contact Length - Post	Contact Finish - Mating	Row Spacing - Mating [x]	Row Spacing - Mating [x]	Current Rating (Amps)	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post
Samtec Inc. ESW-128-23-L-D	Tin	Through Hole	0.1 in	2.54 mm	Forked	Liquid Crystal Polymer (LCP)	Elevated Socket	All	Push-Pull	-55 °C	125 °C	Solder	Black	UL94 V-0	13.6 mm	0.535 in	550 VAC	2	Square	56	Phosphor Bronze	4.83 mm	0.19 in	Gold	2.54 mm	0.1 in	5.2 A	10 çin	0.25 çm
Samtec Inc. ESW-128-33-G-S	Gold	Through Hole	0.1 in	2.54 mm	Forked	Liquid Crystal Polymer (LCP)	Elevated Socket	All	Push-Pull	-55 °C	125 °C	Solder	Black	UL94 V-0	16.13 mm	0.635 in	550 VAC	1	Square	28	Phosphor Bronze	2.29 mm	0.09 "	Gold			5.2 A	20 µin	0.51 µm	3 µin	0.076 µm
Samtec Inc. ESW-128-44-G-D	Gold	Through Hole	0.1 in	2.54 mm	Forked	Liquid Crystal Polymer (LCP)	Elevated Socket	All	Push-Pull	-55 °C	125 °C	Solder	Black	UL94 V-0	18.67 mm	0.735 "	550 VAC	2	Square	56	Phosphor Bronze	4.57 mm	0.18 in	Gold	2.54 mm	0.1 in	5.2 A	20 µin	0.51 µm	3 µin	0.076 µm
Samtec Inc. ESW-128-33-T-S	Tin	Through Hole	0.1 in	2.54 mm	Forked	Liquid Crystal Polymer (LCP)	Elevated Socket	All	Push-Pull	-55 °C	105 ░C	Solder	Black	UL94 V-0	16.13 mm	0.635 in	550 VAC	1	Square	28	Phosphor Bronze	2.29 mm	0.09 "				5.2 A
Samtec Inc. ESW-128-33-G-D	Gold	Through Hole	0.1 in	2.54 mm	Forked	Liquid Crystal Polymer (LCP)	Elevated Socket	All	Push-Pull	-55 °C	125 °C	Solder	Black	UL94 V-0	16.13 mm	0.635 in	550 VAC	2	Square	56	Phosphor Bronze	2.29 mm	0.09 "	Gold	2.54 mm	0.1 in	5.2 A	20 µin	0.51 µm	3 µin	0.076 µm
Samtec Inc. ESW-128-33-T-D	Tin	Through Hole	0.1 in	2.54 mm	Forked	Liquid Crystal Polymer (LCP)	Elevated Socket	All	Push-Pull	-55 °C	105 ░C	Solder	Black	UL94 V-0	16.13 mm	0.635 in	550 VAC	2	Square	56	Phosphor Bronze	2.29 mm	0.09 "		2.54 mm	0.1 in	5.2 A
Samtec Inc. ESW-128-44-L-D	Tin	Through Hole	0.1 in	2.54 mm	Forked	Liquid Crystal Polymer (LCP)	Elevated Socket	All	Push-Pull	-55 °C	125 °C	Solder	Black	UL94 V-0	18.67 mm	0.735 "	550 VAC	2	Square	56	Phosphor Bronze	4.57 mm	0.18 in	Gold	2.54 mm	0.1 in	5.2 A	10 çin	0.25 çm
Samtec Inc. ESW-128-23-G-D	Gold	Through Hole	0.1 in	2.54 mm	Forked	Liquid Crystal Polymer (LCP)	Elevated Socket	All	Push-Pull	-55 °C	125 °C	Solder	Black	UL94 V-0	13.6 mm	0.535 in	550 VAC	2	Square	56	Phosphor Bronze	4.83 mm	0.19 in	Gold	2.54 mm	0.1 in	5.2 A	20 µin	0.51 µm	3 µin	0.076 µm
Samtec Inc. ESW-128-23-S-D	Tin	Through Hole	0.1 in	2.54 mm	Forked	Liquid Crystal Polymer (LCP)	Elevated Socket	All	Push-Pull	-55 °C	125 °C	Solder	Black	UL94 V-0	13.6 mm	0.535 in	550 VAC	2	Square	56	Phosphor Bronze	4.83 mm	0.19 in	Gold	2.54 mm	0.1 in	5.2 A	30 Áin	0.76 Ám