
R9A07 Series
Manufacturer: Renesas Electronics Corporation
IC MPU RZ/T2M 600/800MHZ 320FBGA
| Part | Package Name | Package Width | Package Length | Package / Case | Operating Temperature (Max) | Operating Temperature (Min) | Co-Processors/DSP | Voltage - I/O (Option 2) | Voltage - I/O (Option 1) | Core Processor | Speed | Mounting Type | Additional Interfaces | Ethernet Ports | Ethernet Speed Options | Graphics Acceleration | Bus Width | Number of Cores | USB 2.0 Count | USB | RAM Controllers | Security Features | Ethernet Interface | Display & Interface Controllers | Voltage - I/O (Option 3) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Renesas Electronics Corporation | 320-FBGA 320-LFBGA | 17 mm | 17 mm | 320-LFBGA | 125 °C | -40 °C | Multimedia NEON™ SIMD | 3.3 V | 1.8 V | ARM® Cortex®-R52 | 600 MHz 800 MHz | Surface Mount | CANbus I2C SCI SPI WDT | 2 | 1000Mbps 100Mbps 10Mbps | No | 32 Bit | 2 Core | 1 count | USB 2.0 | |||||
Renesas Electronics Corporation | 361-BGA | 13 mm | 13 mm | 361-LFBGA | 85 °C | -40 °C | AndesCore™ AX45MP | 1 GHz | Surface Mount | CANbus eMMC/SD/SDIO I2C SPI UART | 2 | No | 16 Bit | 1 Core | 2 count | USB 2.0 | DDR3L DDR4 | AES ECC GHASH RSA SHA-1 SHA-224 SHA-256 TRNG | GbE | ||||||
Renesas Electronics Corporation | 128-LFQFP | 20 mm | 14 mm | 128-LQFP Exposed Pad | 125 °C | -40 °C | Multimedia NEON™ SIMD | 3.3 V | 1.8 V | ARM® Cortex®-R52 | 600 MHz 800 MHz | Surface Mount | CANbus I2C SCI SPI WDT | 2 | 1000Mbps 100Mbps 10Mbps | No | 32 Bit | 1 Core | 1 count | USB 2.0 | Boot Security Crypto Accelerator JTAG TRNG | ||||
Renesas Electronics Corporation | 361-PBGA | 13 mm | 13 mm | 361-BGA | 85 °C | -40 °C | 1.8 V | 1.1 V | ARM® Cortex®-A55 | 1 GHz | Surface Mount | CANbus eMMC/SD/SDIO I2C SCI SPI UART | 2 | 1000Mbps 100Mbps 10Mbps | No | 64 Bit | 1 Core | 2 count | USB 2.0 | DDR3L DDR4 | LCD MIPI/CSI2 | 3.3 V | |||
Renesas Electronics Corporation | 225-FBGA 225-LFBGA | 13 mm | 13 mm | 225-LFBGA | 125 °C | -40 °C | Multimedia NEON™ SIMD | 3.3 V | 1.8 V | ARM® Cortex®-R52 | 600 MHz 800 MHz | Surface Mount | CANbus I2C SCI SPI WDT | 2 | 1000Mbps 100Mbps 10Mbps | No | 32 Bit | 2 Core | 1 count | USB 2.0 | |||||
Renesas Electronics Corporation | 551-LFBGA | 21 mm | 21 mm | 551-LFBGA | 85 °C | -40 °C | ARM® Mali-G31 | 3.3 V | 1.8 V | ARM® Cortex®-A55 ARM® Cortex®-M33 | 1.2 GHz 200 MHz | Surface Mount | CANbus eMMC/SD/SDIO I2C SPI UART | 2 | 1000Mbps 100Mbps 10Mbps | No | 64 Bit | 3 Core | 2 count | USB 2.0 | DDR3L DDR4 | MIPI-CSI MIPI-DSI | |||
Renesas Electronics Corporation | 266-BGA | 11 mm | 11 mm | 266-BGA | 85 °C | -40 °C | AndesCore™ AX45MP | 1 GHz | Surface Mount | CANbus eMMC/SD/SDIO I2C SPI UART | 1 | No | 16 Bit | 1 Core | 2 count | USB 2.0 | DDR3L DDR4 | AES ECC GHASH RSA SHA-1 SHA-224 SHA-256 TRNG | GbE | ||||||
Renesas Electronics Corporation | 176-LFQFP | 24 mm | 24 mm | 176-LQFP Exposed Pad | 125 °C | -40 °C | Multimedia NEON™ SIMD | 3.3 V | 1.8 V | ARM® Cortex®-R52 | 600 MHz 800 MHz | Surface Mount | CANbus I2C SCI SPI WDT | 2 | 1000Mbps 100Mbps 10Mbps | No | 32 Bit | 1 Core | 1 count | USB 2.0 | Boot Security Crypto Accelerator JTAG TRNG | ||||
Renesas Electronics Corporation | 225-FBGA 225-LFBGA | 13 mm | 13 mm | 225-LFBGA | 125 °C | -40 °C | Multimedia NEON™ SIMD | 3.3 V | 1.8 V | ARM® Cortex®-R52 | 600 MHz 800 MHz | Surface Mount | CANbus I2C SCI SPI WDT | 2 | 1000Mbps 100Mbps 10Mbps | No | 32 Bit | 2 Core | 1 count | USB 2.0 | Boot Security Crypto Accelerator JTAG TRNG | ||||
Renesas Electronics Corporation | 176-LFQFP | 24 mm | 24 mm | 176-LQFP Exposed Pad | 125 °C | -40 °C | Multimedia NEON™ SIMD | 3.3 V | 1.8 V | ARM® Cortex®-R52 | 600 MHz 800 MHz | Surface Mount | CANbus I2C SCI SPI WDT | 2 | 1000Mbps 100Mbps 10Mbps | No | 32 Bit | 1 Core | 1 count | USB 2.0 |