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CONN IC DIP SOCKET ZIF 32POS TIN
| Part | Termination Post Length | Termination Post Length | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Pitch - Post | Pitch - Post | Current Rating (Amps) | Pitch - Mating | Pitch - Mating | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Contact Material - Mating | Housing Material | Type | Type | Type | Mounting Type | Features | Contact Material - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Termination | Contact Finish - Post | Material Flammability Rating | Contact Finish - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 0.11 in | 2.78 mm | 5.08 µm | 200 µin | 2.54 mm | 0.1 in | 1 A | 0.1 in | 2.54 mm | 2 x 16 | 32 | Beryllium Copper | Polyphenylene Sulfide (PPS) Glass Filled | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | Through Hole | Closed Frame | Beryllium Copper | 200 µin | 5.08 µm | Solder | Tin | UL94 V-0 | |
Aries Electronics | 0.11 in | 2.78 mm | 1.27 µm | 50 µin | 2.54 mm | 0.1 in | 1 A | 0.1 in | 2.54 mm | 2 x 16 | 32 | Beryllium Nickel | Polyphenylene Sulfide (PPS) Glass Filled | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | Through Hole | Closed Frame | Beryllium Nickel | 50 µin | 1.27 µm | Solder | Nickel Boron | UL94 V-0 | Nickel Boron |
Aries Electronics | 0.11 in | 2.78 mm | 0.25 çm | 10 çin | 2.54 mm | 0.1 in | 1 A | 0.1 in | 2.54 mm | 2 x 16 | 32 | Beryllium Copper | Polyphenylene Sulfide (PPS) Glass Filled | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | Through Hole | Closed Frame | Beryllium Copper | 10 çin | 0.25 çm | Solder | Gold | UL94 V-0 | Gold |