32-6570 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN IC DIP SOCKET ZIF 32POS TIN
| Part | Current Rating | Material Flammability Rating | Termination Post Length | Pitch - Post | Contact Finish Thickness - Mating | Features | Grid Columns | Number of Positions or Pins (Grid) | Grid Rows | Housing Material | Mounting Type | Contact Material - Mating | Row Spacing | Type | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Post | Termination | Contact Finish - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 1 A | UL94 V-0 | 0.11 in | 0.1 in | 200 Ąin | Closed Frame | 16 | 32 | 2 | Glass Filled Polyphenylene Sulfide PPS | Through Hole | Beryllium Copper | 0.6 in | 0.6" (15.24mm) Row Spacing DIP ZIF (ZIP) | 0.1 in | Tin | 200 µin | Solder | Tin | Beryllium Copper |
Aries Electronics | 1 A | UL94 V-0 | 0.11 in | 0.1 in | 10 µin | Closed Frame | 16 | 32 | 2 | Glass Filled Polyphenylene Sulfide PPS | Through Hole | Beryllium Copper | 0.6 in | 0.6" (15.24mm) Row Spacing DIP ZIF (ZIP) | 0.1 in | Gold | 10 µin | Solder | Gold | Beryllium Copper |