CONN EDGE DUAL FML 160POS 0.031
| Part | Card Type | Pitch [x] | Pitch [x] | Termination | Card Thickness | Card Thickness | Contact Finish Thickness | Contact Finish Thickness | Contact Material | Material - Insulation | Operating Temperature [Min] | Operating Temperature [Max] | Gender | Contact Finish | Color | Read Out | Mounting Type | Number of Positions/Bay/Row [custom] | Number of Rows | Contact Type | Number of Positions | Features |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Non Specified - Dual Edge | 0.8 mm | 0.031 in | Solder | 0.062 in | 1.57 mm | 0.76 Ám | 30 Áin | Beryllium Copper | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | Female | Gold | Black | Dual | Surface Mount | 80 | 2 | Cantilever | 160 | |
Samtec Inc. | Non Specified - Dual Edge | 0.8 mm | 0.031 in | Solder | 0.093 in | 2.36 mm | 0.25 Ám | 10 Áin | Beryllium Copper | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | Female | Gold | Black | Dual | Surface Mount | 80 | 2 | Cantilever | 160 | Board Guide Solder Retention |
Samtec Inc. | Non Specified - Dual Edge | 0.8 mm | 0.031 in | Solder | 0.062 in | 1.57 mm | 0.25 Ám | 10 Áin | Beryllium Copper | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | Female | Gold | Black | Dual | Surface Mount | 80 | 2 | Cantilever | 160 | |
Samtec Inc. | Non Specified - Dual Edge | 0.8 mm | 0.031 in | Solder | 0.093 in | 2.36 mm | 0.25 Ám | 10 Áin | Beryllium Copper | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | Female | Gold | Black | Dual | Surface Mount | 80 | 2 | Cantilever | 160 | Board Guide |
Samtec Inc. | Non Specified - Dual Edge | 0.8 mm | 0.031 in | Solder | 0.062 in | 1.57 mm | 0.76 Ám | 30 Áin | Beryllium Copper | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | Female | Gold | Black | Dual | Surface Mount | 80 | 2 | Cantilever | 160 | Board Guide |
Samtec Inc. | Non Specified - Dual Edge | 0.8 mm | 0.031 in | Solder | 0.093 in | 2.36 mm | 0.25 Ám | 10 Áin | Beryllium Copper | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | Female | Gold | Black | Dual | Surface Mount | 80 | 2 | Cantilever | 160 | |
Samtec Inc. | Non Specified - Dual Edge | 0.8 mm | 0.031 in | Solder | 0.062 in | 1.57 mm | 0.25 Ám | 10 Áin | Beryllium Copper | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | Female | Gold | Black | Dual | Surface Mount | 80 | 2 | Cantilever | 160 | Board Guide |
Samtec Inc. | Non Specified - Dual Edge | 0.8 mm | 0.031 in | Solder | 0.062 in | 1.57 mm | 0.76 Ám | 30 Áin | Beryllium Copper | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | Female | Gold | Black | Dual | Surface Mount | 80 | 2 | Cantilever | 160 | Board Guide Board Lock |
Samtec Inc. | Non Specified - Dual Edge | 0.8 mm | 0.031 in | Solder | 0.093 in | 2.36 mm | 0.25 Ám | 10 Áin | Beryllium Copper | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | Female | Gold | Black | Dual | Surface Mount | 80 | 2 | Cantilever | 160 | Board Guide |
Samtec Inc. | Non Specified - Dual Edge | 0.8 mm | 0.031 in | Solder | 0.093 in | 2.36 mm | 0.76 Ám | 30 Áin | Beryllium Copper | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | Female | Gold | Black | Dual | Surface Mount | 80 | 2 | Cantilever | 160 | Board Guide |