ESQT-118 Series

Catalog

CONN SOCKET 36POS 0.079 GOLD PCB

Part	Number of Positions Loaded	Contact Length - Post	Contact Length - Post	Contact Type	Number of Positions	Termination	Operating Temperature [Min]	Operating Temperature [Max]	Connector Type	Contact Finish - Mating	Insulation Color	Mounting Type	Material Flammability Rating	Style	Insulation Material	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Fastening Type	Contact Shape	Row Spacing - Mating	Row Spacing - Mating	Contact Material	Number of Rows	Current Rating (Amps)	Insulation Height	Insulation Height	Contact Finish - Post	Pitch - Mating [x]	Pitch - Mating [x]	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Length - Post [x]	Contact Length - Post [x]
Samtec Inc. ESQT-118-03-F-D-375	All	0.083 in	2.11 mm	Forked	36	Solder	-55 °C	125 °C	Elevated Socket	Gold	Black	Through Hole	UL94 V-0	Board to Board Cable	Liquid Crystal Polymer (LCP)	3 µin	0.076 µm	Push-Pull	Square	0.079 in	2 mm	Phosphor Bronze	2	4.5 A	0.375 in	9.53 mm	Tin	0.079 in	2 mm
Samtec Inc. ESQT-118-02-G-T-532	All	0.318 in	8.08 mm	Forked	54	Solder	-55 °C	125 °C	Elevated Socket	Gold	Black	Through Hole	UL94 V-0	Board to Board Cable	Liquid Crystal Polymer (LCP)	20 µin	0.51 µm	Push-Pull	Square	0.079 in	2 mm	Phosphor Bronze	3	4.5 A	0.532 "	13.51 mm	Gold	0.079 in	2 mm	3 µin	0.076 µm
Samtec Inc. ESQT-118-03-G-D-329	All	0.129 "	3.28 mm	Forked	36	Solder	-55 °C	125 °C	Elevated Socket	Gold	Black	Through Hole	UL94 V-0	Board to Board Cable	Liquid Crystal Polymer (LCP)	20 µin	0.51 µm	Push-Pull	Square	0.079 in	2 mm	Phosphor Bronze	2	4.5 A	0.329 in	8.36 mm	Gold	0.079 in	2 mm	3 µin	0.076 µm
Samtec Inc. ESQT-118-02-G-T-700	All			Forked	54	Solder	-55 °C	125 °C	Elevated Socket	Gold	Black	Through Hole	UL94 V-0	Board to Board Cable	Liquid Crystal Polymer (LCP)	20 µin	0.51 µm	Push-Pull	Square	0.079 in	2 mm	Phosphor Bronze	3	4.5 A	0.7 in	17.78 mm	Gold	0.079 in	2 mm	3 µin	0.076 µm	0.15 in	3.81 mm
Samtec Inc. ESQT-118-03-G-D-380	All			Forked	36	Solder	-55 °C	125 °C	Elevated Socket	Gold	Black	Through Hole	UL94 V-0	Board to Board Cable	Liquid Crystal Polymer (LCP)	20 µin	0.51 µm	Push-Pull	Square	0.079 in	2 mm	Phosphor Bronze	2	4.5 A	0.38 in	9.65 mm	Gold	0.079 in	2 mm	3 µin	0.076 µm	0.078 in	1.98 mm
Samtec Inc. ESQT-118-03-G-Q-368	All	0.09 "	2.29 mm	Forked	72	Solder	-55 °C	125 °C	Elevated Socket	Gold	Black	Through Hole	UL94 V-0	Board to Board Cable	Liquid Crystal Polymer (LCP)	20 µin	0.51 µm	Push-Pull	Square	0.079 in	2 mm	Phosphor Bronze		4.5 A	0.368 in	9.35 mm	Gold	0.079 in	2 mm	3 µin	0.076 µm
Samtec Inc. ESQT-118-02-M-D-790	All			Forked	36	Solder	-55 °C	125 °C	Elevated Socket	Gold	Black	Through Hole	UL94 V-0	Board to Board Cable	Liquid Crystal Polymer (LCP)	20 µin	0.51 µm	Push-Pull	Square	0.079 in	2 mm	Phosphor Bronze	2	4.5 A	0.79 in	20.07 mm	Tin	0.079 in	2 mm			0.06 in	1.52 mm
Samtec Inc. ESQT-118-02-G-D-500	All			Forked	36	Solder	-55 °C	125 °C	Elevated Socket	Gold	Black	Through Hole	UL94 V-0	Board to Board Cable	Liquid Crystal Polymer (LCP)	20 µin	0.51 µm	Push-Pull	Square	0.079 in	2 mm	Phosphor Bronze	2	4.5 A	0.5 in	12.7 mm	Gold	0.079 in	2 mm	3 µin	0.076 µm	0.35 in	8.89 mm
Samtec Inc. ESQT-118-02-F-D-400	All	0.45 "	11.43 mm	Forked	36	Solder	-55 °C	125 °C	Elevated Socket	Gold	Black	Through Hole	UL94 V-0	Board to Board Cable	Liquid Crystal Polymer (LCP)	3 µin	0.076 µm	Push-Pull	Square	0.079 in	2 mm	Phosphor Bronze	2	4.5 A	0.4 in	10.16 mm	Tin	0.079 in	2 mm
Samtec Inc. ESQT-118-02-G-D-790	All			Forked	36	Solder	-55 °C	125 °C	Elevated Socket	Gold	Black	Through Hole	UL94 V-0	Board to Board Cable	Liquid Crystal Polymer (LCP)	20 µin	0.51 µm	Push-Pull	Square	0.079 in	2 mm	Phosphor Bronze	2	4.5 A	0.79 in	20.07 mm	Gold	0.079 in	2 mm	3 µin	0.076 µm	0.06 in	1.52 mm