Catalog
2.5-V, 1:1 (SPST), 1-channel analog switch
Key Features
• Available in the Texas Instruments NanoFree™ PackageWide VCCRange of 0.8 V to 2.7 VSub-1-V OperableLow Power Consumption, 10-µA Max ICCHigh On-Off Output Voltage RatioHigh Degree of LinearityHigh Speed – Max 0.2 ns(VCC= 1.8 V, CL= 15 pF)Low On-State Impedance – Typically 9(VCC= 2.3 V)Latch-Up Performance Exceeds 100 mA PerJESD 78, Class IIESD Protection Exceeds JESD 222000-V Human-Body Model (A114-A)200-V Machine Model (A115-A)1000-V Charged-Device Model (C101)NanoFree Is a trademark of Texas Instruments.Available in the Texas Instruments NanoFree™ PackageWide VCCRange of 0.8 V to 2.7 VSub-1-V OperableLow Power Consumption, 10-µA Max ICCHigh On-Off Output Voltage RatioHigh Degree of LinearityHigh Speed – Max 0.2 ns(VCC= 1.8 V, CL= 15 pF)Low On-State Impedance – Typically 9(VCC= 2.3 V)Latch-Up Performance Exceeds 100 mA PerJESD 78, Class IIESD Protection Exceeds JESD 222000-V Human-Body Model (A114-A)200-V Machine Model (A115-A)1000-V Charged-Device Model (C101)NanoFree Is a trademark of Texas Instruments.
Description
AI
This single analog switch is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCCoperation.
The SN74AUC1G66 can handle both analog and digital signals. The combined AC and DC signal has to be between VCCand GND for it to be transmitted in either direction.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems.
This single analog switch is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCCoperation.
The SN74AUC1G66 can handle both analog and digital signals. The combined AC and DC signal has to be between VCCand GND for it to be transmitted in either direction.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems.