14-C280 Series

Catalog

CONN IC DIP SOCKET 14POS GOLD

Part	Termination Post Length	Current Rating	Material Flammability Rating	Pitch - Mating	Contact Material - Mating	Termination	Pitch - Post	Mounting Type	Features	Number of Positions or Pins (Grid)	Grid Columns	Grid Rows	Row Spacing	Type	Contact Finish Thickness - Post	Contact Finish - Mating	Contact Material - Post	Contact Finish - Post	Housing Material	Contact Finish Thickness - Mating	Operating Temperature (Max)	Operating Temperature (Min)
Aries Electronics 14-C280-31	0.04 in	3 A	UL94 V-0	0.1 in	Beryllium Copper	Solder	0.1 in	Surface Mount	Closed Frame	14	7	2	0.3 in	0.3" (7.62mm) Row Spacing DIP	10 µin	Gold	Brass	Gold	Glass Filled Nylon 4/6 PA46 Polyamide	10 µin	125 °C	-55 °C
Aries Electronics 14-C280-30	0.04 in	3 A	UL94 V-0	0.1 in	Beryllium Copper	Solder	0.1 in	Surface Mount	Closed Frame	14	7	2	0.3 in	0.3" (7.62mm) Row Spacing DIP	200 µin	Gold	Brass	Tin	Glass Filled Nylon 4/6 PA46 Polyamide	10 µin	105 °C	-55 °C
Aries Electronics 14-C280-10	0.125 in	3 A	UL94 V-0	0.1 in	Beryllium Copper	Solder	0.1 in	Through Hole	Closed Frame	14	7	2	0.3 in	0.3" (7.62mm) Row Spacing DIP	200 µin	Gold	Brass	Tin	Glass Filled Nylon 4/6 PA46 Polyamide	10 µin	105 °C	-55 °C
Aries Electronics 14-C280-10T	0.125 in	3 A	UL94 V-0	0.1 in	Beryllium Copper	Solder	0.1 in	Through Hole	Closed Frame	14	7	2	0.3 in	0.3" (7.62mm) Row Spacing DIP	200 µin	Tin	Brass	Tin	Glass Filled Nylon 4/6 PA46 Polyamide	200 Ąin	105 °C	-55 °C