14-C280 Series

Catalog

CONN IC DIP SOCKET 14POS GOLD

Part	Mounting Type	Contact Material - Mating	Number of Positions or Pins (Grid)	Termination	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination Post Length	Termination Post Length	Housing Material	Contact Finish - Mating	Contact Material - Post [custom]	Pitch - Post	Pitch - Post	Material Flammability Rating	Type	Type	Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Current Rating (Amps)	Contact Finish - Post	Features	Operating Temperature [Max]	Operating Temperature [Min]
Aries Electronics 14-C280-30	Surface Mount	Beryllium Copper	14	Solder	0.1 in	2.54 mm	10 çin	0.25 çm	0.04 in	1.02 mm	Glass Filled Nylon 4/6 Polyamide (PA46)	Gold	Brass	2.54 mm	0.1 in	UL94 V-0	0.3 "	7.62 mm	DIP	200 µin	5.08 µm	3 A	Tin	Closed Frame	105 ░C	-55 °C
Aries Electronics 14-C280-10	Through Hole	Beryllium Copper	14	Solder	0.1 in	2.54 mm	10 çin	0.25 çm	0.125 in	3.18 mm	Glass Filled Nylon 4/6 Polyamide (PA46)	Gold	Brass	2.54 mm	0.1 in	UL94 V-0	0.3 "	7.62 mm	DIP	200 µin	5.08 µm	3 A	Tin	Closed Frame	105 ░C	-55 °C
Aries Electronics 14-C280-00	Surface Mount	Beryllium Copper	14	Solder	0.1 in	2.54 mm	10 çin	0.25 çm	0.04 in	1.02 mm	Glass Filled Nylon 4/6 Polyamide (PA46)	Gold	Brass	2.54 mm	0.1 in	UL94 V-0	0.3 "	7.62 mm	DIP	200 µin	5.08 µm	3 A	Tin	Closed Frame	105 ░C	-55 °C
Aries Electronics 14-C280-10T	Through Hole	Beryllium Copper	14	Solder	0.1 in	2.54 mm	200 µin	5.08 µm	0.125 in	3.18 mm	Glass Filled Nylon 4/6 Polyamide (PA46)		Brass	2.54 mm	0.1 in	UL94 V-0	0.3 "	7.62 mm	DIP	200 µin	5.08 µm	3 A	Tin	Closed Frame	105 ░C	-55 °C