TMM-115 Series
Manufacturer: Samtec Inc.
Beta
⌘K
2MM TERMINAL STRIP
| Part | Shrouding | Contact Material | Number of Rows | Mounting Type | Pitch - Mating | Insulation Color | Fastening Type | Style | Termination | Contact Finish Thickness - Mating | Contact Finish - Mating | Insulation Height | Connector Type | Number of Positions Loaded | Insulation Material | Contact Shape | Current Rating (Per Contact) | Contact Length - Mating | Row Spacing - Mating | Contact Type | Number of Positions | Contact Length - Post | Contact Finish - Post | Operating Temperature (Max) | Operating Temperature (Min) | Material Flammability Rating | Number of Positions Loaded | Overall Contact Length | Contact Finish Thickness - Post | Features |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Samtec Inc. | Unshrouded | Phosphor Bronze | 2 | Right Angle Through Hole | 0.079 in | Black | Push-Pull | Board Board or Cable | Solder | 10 µin | Gold | 0.155 in | Header | All | Liquid Crystal Polymer (LCP) | Square | 3.2 A | 0.126 in | 0.079 in | Male Pin | 30 | 0.12 in | Tin | 125 °C | -55 °C | |||||
 Samtec Inc. | Unshrouded | Phosphor Bronze | 2 | Surface Mount | 0.079 in | Black | Push-Pull | Board Board or Cable | Solder | 10 µin | Gold | 0.059 in | Header | All | Liquid Crystal Polymer (LCP) | Square | 3.2 A | 0.126 in | 0.079 in | Male Pin | 30 | Tin | 125 °C | -55 °C | UL94 V-0 | |||||
 Samtec Inc. | Unshrouded | Phosphor Bronze | 4 | Through Hole | 0.079 in | Black | Push-Pull | Board Board or Cable | Solder | 20 Ąin | Gold | 0.059 in | Header | Liquid Crystal Polymer (LCP) | Square | 3.2 A | 0.126 in | 0.079 in | Male Pin | 60 | 0.138 in | Gold | 125 °C | -55 °C | 59 | 0.323 in | 3 µin | |||
Samtec Inc. | Unshrouded | Phosphor Bronze | 2 | Surface Mount | 0.079 in | Black | Push-Pull | Board Board or Cable | Solder | 3 µin | Gold | 0.059 in | Header | All | Liquid Crystal Polymer (LCP) | Square | 3.2 A | 0.126 in | 0.079 in | Male Pin | 30 | Tin | 125 °C | -55 °C | UL94 V-0 | Pick and Place | ||||
 Samtec Inc. | Unshrouded | Phosphor Bronze | 2 | Through Hole | 0.079 in | Black | Push-Pull | Board Board or Cable | Solder | 30 µin | Gold | 0.059 in | Header | All | Liquid Crystal Polymer (LCP) | Square | 3.2 A | 0.146 in | 0.079 in | Male Pin | 30 | 0.118 in | Tin | 125 °C | -55 °C | 0.323 in | ||||
 Samtec Inc. | Unshrouded | Phosphor Bronze | 4 | Right Angle Through Hole | 0.079 in | Black | Push-Pull | Board Board or Cable | Solder | 30 µin | Gold | 0.315 in | Header | All | Liquid Crystal Polymer (LCP) | Square | 3.2 A | 0.126 in | 0.079 in | Male Pin | 60 | 0.12 in | Tin | 125 °C | -55 °C | |||||
Samtec Inc. | Unshrouded | Phosphor Bronze | 2 | Through Hole | 0.079 in | Black | Push-Pull | Board Board or Cable | Solder | 20 Ąin | Gold | 0.059 in | Header | Liquid Crystal Polymer (LCP) | Square | 3.2 A | 0.146 in | 0.079 in | Male Pin | 30 | 0.118 in | Gold | 125 °C | -55 °C | 29 | 0.323 in | 3 µin | |||
Samtec Inc. | Unshrouded | Phosphor Bronze | 2 | Surface Mount | 0.079 in | Black | Push-Pull | Board Board or Cable | Solder | 30 µin | Gold | 0.059 in | Header | All | Liquid Crystal Polymer (LCP) | Square | 3.2 A | 0.168 in | 0.079 in | Male Pin | 30 | Tin | 125 °C | -55 °C | UL94 V-0 | Board Guide Pick and Place | ||||
 Samtec Inc. | Unshrouded | Phosphor Bronze | 2 | Surface Mount | 0.079 in | Black | Push-Pull | Board Board or Cable | Solder | 10 µin | Gold | 0.059 in | Header | All | Liquid Crystal Polymer (LCP) | Square | 3.2 A | 0.168 in | 0.079 in | Male Pin | 30 | Tin | 125 °C | -55 °C | UL94 V-0 | |||||
 Samtec Inc. | Unshrouded | Phosphor Bronze | 2 | Surface Mount | 0.079 in | Black | Push-Pull | Board Board or Cable | Solder | 20 Ąin | Gold | 0.059 in | Header | All | Liquid Crystal Polymer (LCP) | Square | 3.2 A | 0.168 in | 0.079 in | Male Pin | 30 | Gold | 125 °C | -55 °C | UL94 V-0 | 3 µin | Pick and Place |