TMM-115 Series

Catalog

2MM TERMINAL STRIP

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Part	Insulation Material	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material	Operating Temperature [Min]	Operating Temperature [Max]	Contact Finish - Post	Connector Type	Insulation Height	Insulation Height	Insulation Color	Contact Shape	Mounting Type	Contact Length - Mating	Contact Length - Mating	Pitch - Mating [x]	Pitch - Mating [x]	Style	Row Spacing - Mating	Row Spacing - Mating	Fastening Type	Shrouding	Number of Positions	Number of Positions Loaded	Termination	Contact Length - Post [x]	Contact Length - Post [x]	Current Rating (Amps)	Contact Type	Number of Rows	Material Flammability Rating	Contact Length - Post	Contact Length - Post	Overall Contact Length	Overall Contact Length	Number of Positions Loaded	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Features
Samtec Inc. TMM-115-01-L-D-RE	Liquid Crystal Polymer (LCP)	Gold	10 çin	0.25 çm	Phosphor Bronze	-55 °C	125 °C	Tin	Header	0.155 in	3.94 mm	Black	Square	Through Hole Right Angle	3.2 mm	0.126 "	0.079 in	2 mm	Board to Board Cable	0.079 in	2 mm	Push-Pull	Unshrouded	30	All	Solder	0.12 in	3.05 mm	3.2 A	Male Pin	2
Samtec Inc. TMM-115-01-L-D-SM	Liquid Crystal Polymer (LCP)	Gold	10 çin	0.25 çm	Phosphor Bronze	-55 °C	125 °C	Tin	Header	0.059 "	1.5 mm	Black	Square	Surface Mount	3.2 mm	0.126 "	0.079 in	2 mm	Board to Board Cable	0.079 in	2 mm	Push-Pull	Unshrouded	30	All	Solder			3.2 A	Male Pin	2	UL94 V-0
Samtec Inc. TMM-115-01-G-Q-029	Liquid Crystal Polymer (LCP)	Gold	20 µin	0.51 µm	Phosphor Bronze	-55 °C	125 °C	Gold	Header	0.059 "	1.5 mm	Black	Square	Through Hole	3.2 mm	0.126 "	0.079 in	2 mm	Board to Board Cable	0.079 in	2 mm	Push-Pull	Unshrouded	60		Solder			3.2 A	Male Pin			3.5 mm	0.138 in	8.2 mm	0.323 in	59	3 µin	0.076 µm
Samtec Inc. TMM-115-01-F-D-SM-P-TR	Liquid Crystal Polymer (LCP)	Gold	3 µin	0.076 µm	Phosphor Bronze	-55 °C	125 °C	Tin	Header	0.059 "	1.5 mm	Black	Square	Surface Mount	3.2 mm	0.126 "	0.079 in	2 mm	Board to Board Cable	0.079 in	2 mm	Push-Pull	Unshrouded	30	All	Solder			3.2 A	Male Pin	2	UL94 V-0								Pick and Place
Samtec Inc. TMM-115-02-S-D	Liquid Crystal Polymer (LCP)	Gold	30 Áin	0.76 Ám	Phosphor Bronze	-55 °C	125 °C	Tin	Header	0.059 "	1.5 mm	Black	Square	Through Hole			0.079 in	2 mm	Board to Board Cable	0.079 in	2 mm	Push-Pull	Unshrouded	30	All	Solder			3.2 A	Male Pin	2		3 mm	0.118 in	8.2 mm	0.323 in
Samtec Inc. TMM-115-01-G-Q	Liquid Crystal Polymer (LCP)	Gold	20 µin	0.51 µm	Phosphor Bronze	-55 °C	125 °C	Gold	Header	0.059 "	1.5 mm	Black	Square	Through Hole	3.2 mm	0.126 "	0.079 in	2 mm	Board to Board Cable	0.079 in	2 mm	Push-Pull	Unshrouded	60	All	Solder			3.2 A	Male Pin			3.5 mm	0.138 in	8.2 mm	0.323 in		3 µin	0.076 µm
Samtec Inc. TMM-115-01-S-Q-RA	Liquid Crystal Polymer (LCP)	Gold	30 Áin	0.76 Ám	Phosphor Bronze	-55 °C	125 °C	Tin	Header	0.315 in	8 mm	Black	Square	Through Hole Right Angle	3.2 mm	0.126 "	0.079 in	2 mm	Board to Board Cable	0.079 in	2 mm	Push-Pull	Unshrouded	60	All	Solder	0.12 in	3.05 mm	3.2 A	Male Pin
Samtec Inc. TMM-115-02-G-D-001	Liquid Crystal Polymer (LCP)	Gold	20 µin	0.51 µm	Phosphor Bronze	-55 °C	125 °C	Gold	Header	0.059 "	1.5 mm	Black	Square	Through Hole			0.079 in	2 mm	Board to Board Cable	0.079 in	2 mm	Push-Pull	Unshrouded	30		Solder			3.2 A	Male Pin	2		3 mm	0.118 in	8.2 mm	0.323 in	29	3 µin	0.076 µm
Samtec Inc. TMM-115-06-S-D-SM-A-M-TR	Liquid Crystal Polymer (LCP)	Gold	30 Áin	0.76 Ám	Phosphor Bronze	-55 °C	125 °C	Tin	Header	0.059 "	1.5 mm	Black	Square	Surface Mount	4.27 mm	0.168 in	0.079 in	2 mm	Board to Board Cable	0.079 in	2 mm	Push-Pull	Unshrouded	30	All	Solder			3.2 A	Male Pin	2	UL94 V-0								Board Guide Pick and Place
Samtec Inc. TMM-115-06-L-D-SM	Liquid Crystal Polymer (LCP)	Gold	10 çin	0.25 çm	Phosphor Bronze	-55 °C	125 °C	Tin	Header	0.059 "	1.5 mm	Black	Square	Surface Mount	4.27 mm	0.168 in	0.079 in	2 mm	Board to Board Cable	0.079 in	2 mm	Push-Pull	Unshrouded	30	All	Solder			3.2 A	Male Pin	2	UL94 V-0