CONN SOCKET PGA ZIF GOLD
| Part | Mounting Type | Material Flammability Rating | Contact Material - Mating | Features | Contact Material - Post | Contact Finish - Mating | Pitch - Mating | Pitch - Mating | Operating Temperature [Max] | Operating Temperature [Min] | Pitch - Post | Pitch - Post | Current Rating (Amps) | Contact Finish - Post | Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Termination | Termination Post Length | Termination Post Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Through Hole | UL94 V-0 | Beryllium Copper | Closed Frame | Beryllium Copper | Gold | 0.1 in | 2.54 mm | 125 °C | -65 ░C | 2.54 mm | 0.1 in | 1 A | Tin | PGA ZIF (ZIP) | 30 Áin | 0.76 Ám | 200 µin | 5.08 µm | Solder | 3.18 mm | 0.125 in |
Aries Electronics | Through Hole | UL94 V-0 | Beryllium Copper | Closed Frame | Beryllium Copper | Gold | 0.1 in | 2.54 mm | 125 °C | -65 ░C | 2.54 mm | 0.1 in | 1 A | Tin | PGA ZIF (ZIP) | 30 Áin | 0.76 Ám | 200 µin | 5.08 µm | Solder | 3.18 mm | 0.125 in |
Aries Electronics | Through Hole | UL94 V-0 | Beryllium Copper | Closed Frame | Beryllium Copper | Gold | 0.1 in | 2.54 mm | 125 °C | -65 ░C | 2.54 mm | 0.1 in | 1 A | Tin | PGA ZIF (ZIP) | 30 Áin | 0.76 Ám | 200 µin | 5.08 µm | Solder | 3.18 mm | 0.125 in |
Aries Electronics | Through Hole | UL94 V-0 | Beryllium Copper | Closed Frame | Beryllium Copper | Gold | 0.1 in | 2.54 mm | 125 °C | -65 ░C | 2.54 mm | 0.1 in | 1 A | Tin | PGA ZIF (ZIP) | 30 Áin | 0.76 Ám | 200 µin | 5.08 µm | Solder | 3.18 mm | 0.125 in |