HEATSINK CPU W/ADHESIVE 1.81"SQ
| Part | Thermal Resistance @ Natural | Type | Package Cooled | Thermal Resistance @ Forced Air Flow | Shelf Life | Material Finish | Length | Length | Shape | Attachment Method | Width [x] | Width [x] | Material | Fin Height [z] | Fin Height [z] | Fin Height | Fin Height | 
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Tusonix a Subsidiary of CTS Electronic Components  | 8.1 °C/W  | Top Mount  | ASIC  BGA  CPU  LGA  | 2.8 °C/W  400 LFM  | 24 Months  | Black Anodized  | 1.81 "  | 45.97 mm  | Pin Fins  Square  | Thermal Tape  Adhesive (Included)  | 45.97 mm  | 1.81 in  | Aluminum  | 15.37 mm  | 0.605 in  | ||
Tusonix a Subsidiary of CTS Electronic Components  | 10.8 °C/W  | Top Mount  | ASIC  BGA  CPU  LGA  | 3.5 °C/W  400 LFM  | 24 Months  | Black Anodized  | 1.81 "  | 45.97 mm  | Pin Fins  Square  | Thermal Tape  Adhesive (Included)  | 45.97 mm  | 1.81 in  | Aluminum  | 9.02 mm  | 0.355 in  |