HEATSINK CPU W/ADHESIVE 1.81"SQ
| Part | Thermal Resistance @ Natural | Type | Package Cooled | Thermal Resistance @ Forced Air Flow | Shelf Life | Material Finish | Length | Length | Shape | Attachment Method | Width [x] | Width [x] | Material | Fin Height [z] | Fin Height [z] | Fin Height | Fin Height |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Tusonix a Subsidiary of CTS Electronic Components | 8.1 °C/W | Top Mount | ASIC BGA CPU LGA | 2.8 °C/W 400 LFM | 24 Months | Black Anodized | 1.81 " | 45.97 mm | Pin Fins Square | Thermal Tape Adhesive (Included) | 45.97 mm | 1.81 in | Aluminum | 15.37 mm | 0.605 in | ||
Tusonix a Subsidiary of CTS Electronic Components | 10.8 °C/W | Top Mount | ASIC BGA CPU LGA | 3.5 °C/W 400 LFM | 24 Months | Black Anodized | 1.81 " | 45.97 mm | Pin Fins Square | Thermal Tape Adhesive (Included) | 45.97 mm | 1.81 in | Aluminum | 9.02 mm | 0.355 in |