HTSW-122 Series

Catalog

HEADERS & WIRE HOUSINGS HIGH TEMPERATURE PCB HEADER STRIPS

Part	Overall Contact Length	Insulation Color	Contact Length - Post	Number of Positions Loaded	Number of Rows	Contact Finish Thickness - Mating	Mounting Type	Connector Type	Contact Finish - Post	Contact Shape	Insulation Height	Material Flammability Rating	Number of Positions	Operating Temperature (Max)	Operating Temperature (Min)	Current Rating	Current Rating	Contact Material	Contact Type	Style	Contact Length - Mating	Pitch - Mating	Insulation Material	Fastening Type	Contact Finish - Mating	Termination	Shrouding	Row Spacing - Mating	Contact Finish Thickness - Post
Samtec Inc. HTSW-122-07-F-S	0.43 in	Natural	0.1 in	All	1	3 µin	Through Hole	Header	Tin	Square	0.1 in	UL94 V-0	22	125 °C	-55 °C	0 A	Varies by Wire Gauge	Phosphor Bronze	Male Pin	Board Board or Cable	0.23 in	0.1 in	Liquid Crystal Polymer (LCP)	Push-Pull	Gold	Solder	Unshrouded
Samtec Inc. HTSW-122-07-T-S	0.43 in	Natural	0.1 in	All	1		Through Hole	Header	Tin	Square	0.1 in	UL94 V-0	22	105 °C	-55 °C	0 A	Varies by Wire Gauge	Phosphor Bronze	Male Pin	Board Board or Cable	0.23 in	0.1 in	Liquid Crystal Polymer (LCP)	Push-Pull	Tin	Solder	Unshrouded
Samtec Inc. HTSW-122-18-T-D	0.93 in	Natural	0.11 in	All	2		Through Hole	Header	Tin	Square			44			0 A	Varies by Wire Gauge	Phosphor Bronze	Male Pin	Board Board or Cable	0.72 in	0.1 in	Liquid Crystal Polymer (LCP)	Push-Pull	Tin	Solder	Unshrouded	0.1 in
Samtec Inc. HTSW-122-07-G-T	0.43 in	Natural	0.1 in	All	3	10 µin	Through Hole	Header	Gold	Square	0.1 in	UL94 V-0	66	125 °C	-55 °C	0 A	Varies by Wire Gauge	Phosphor Bronze	Male Pin	Board Board or Cable	0.23 in	0.1 in	Liquid Crystal Polymer (LCP)	Push-Pull	Gold	Solder	Unshrouded	0.1 in	3 µin
Samtec Inc. HTSW-122-08-G-S	0.53 in	Natural	0.2 in	All	1	10 µin	Through Hole	Header	Gold	Square	0.1 in	UL94 V-0	22	125 °C	-55 °C	0 A	Varies by Wire Gauge	Phosphor Bronze	Male Pin	Board Board or Cable	0.23 in	0.1 in	Liquid Crystal Polymer (LCP)	Push-Pull	Gold	Solder	Unshrouded		3 µin
Samtec Inc. HTSW-122-25-S-D-RA		Natural	0.1 in	All	2	30 µin	Right Angle Through Hole	Header	Tin	Square	0.24 in	UL94 V-0	44	125 °C	-55 °C	0 A	Varies by Wire Gauge	Phosphor Bronze	Male Pin	Board Board or Cable	0.32 in	0.1 in	Liquid Crystal Polymer (LCP)	Push-Pull	Gold	Solder	Unshrouded	0.1 in
Samtec Inc. HTSW-122-08-G-D		Natural			2		Through Hole	Header	Gold	Square		UL94 V-0	44	125 °C	-55 °C			Phosphor Bronze	Male Pin	Board Board or Cable		0.1 in	Liquid Crystal Polymer (LCP)	Push-Pull	Gold	Solder	Unshrouded
Samtec Inc. HTSW-122-42-L-D	0.47 in	Natural	0.05 in	All	2	10 µin	Through Hole	Header	Tin	Square	0.1 in	UL94 V-0	44	125 °C	-55 °C	0 A	Varies by Wire Gauge	Phosphor Bronze	Male Pin	Board Board or Cable	0.32 in	0.1 in	Liquid Crystal Polymer (LCP)	Push-Pull	Gold	Solder	Unshrouded	0.1 in
Samtec Inc. HTSW-122-42-G-T	0.47 in	Natural	0.05 in	All	3	10 µin	Through Hole	Header	Gold	Square	0.1 in	UL94 V-0	66	125 °C	-55 °C	0 A	Varies by Wire Gauge	Phosphor Bronze	Male Pin	Board Board or Cable	0.32 in	0.1 in	Liquid Crystal Polymer (LCP)	Push-Pull	Gold	Solder	Unshrouded	0.1 in	3 µin
Samtec Inc. HTSW-122-07-TM-D	0.43 in	Natural	0.1 in	All	2		Through Hole	Header	Tin	Square	0.1 in	UL94 V-0	44	105 °C	-55 °C	0 A	Varies by Wire Gauge	Phosphor Bronze	Male Pin	Board Board or Cable	0.23 in	0.1 in	Liquid Crystal Polymer (LCP)	Push-Pull	Tin	Solder	Unshrouded	0.1 in