28-6573 Series

Catalog

CONN IC DIP SOCKET ZIF 28POS TIN

Part	Material Flammability Rating	Contact Material - Mating	Housing Material	Pitch - Mating	Pitch - Mating	Type	Type	Type	Number of Positions or Pins (Grid)	Termination	Current Rating (Amps)	Contact Material - Post	Contact Finish - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Mounting Type	Features	Pitch - Post	Pitch - Post	Termination Post Length	Termination Post Length
Aries Electronics 28-6573-11	UL94 V-0	Beryllium Copper	Polyphenylene Sulfide (PPS) Glass Filled	0.1 in	2.54 mm	15.24 mm	DIP ZIF (ZIP)	0.6 "	28	Solder	1 A	Beryllium Copper	Tin	5.08 µm	200 µin	200 µin	5.08 µm	Through Hole	Closed Frame	2.54 mm	0.1 in	0.11 in	2.78 mm
Aries Electronics 28-6573-16	UL94 V-0	Beryllium Copper	Polyphenylene Sulfide (PPS) Glass Filled	0.1 in	2.54 mm	15.24 mm	DIP ZIF (ZIP)	0.6 "	28	Solder	1 A	Beryllium Copper	Tin	5.08 µm	200 µin	200 µin	5.08 µm	Through Hole	Closed Frame	2.54 mm	0.1 in	0.11 in	2.78 mm
Aries Electronics 28-6573-18	UL94 V-0	Beryllium Copper	Polyphenylene Sulfide (PPS) Glass Filled	0.1 in	2.54 mm	15.24 mm	DIP ZIF (ZIP)	0.6 "	28	Solder	1 A	Beryllium Copper	Tin	5.08 µm	200 µin	200 µin	5.08 µm	Through Hole	Closed Frame	2.54 mm	0.1 in	0.11 in	2.78 mm
Aries Electronics 28-6573-10	UL94 V-0	Beryllium Copper	Polyphenylene Sulfide (PPS) Glass Filled	0.1 in	2.54 mm	15.24 mm	DIP ZIF (ZIP)	0.6 "	28	Solder	1 A	Beryllium Copper	Tin	5.08 µm	200 µin	200 µin	5.08 µm	Through Hole	Closed Frame	2.54 mm	0.1 in	0.11 in	2.78 mm