PHT Series
Manufacturer: Samtec Inc.
HEADERS & WIRE HOUSINGS .100" TERMINAL STRIP, PRESS-FIT
| Part | Style | Operating Temperature (Max) | Operating Temperature (Min) | Insulation Color | Contact Finish Thickness - Mating | Current Rating (Per Contact) | Insulation Height | Number of Rows | Number of Positions | Contact Material | Contact Shape | Pitch - Mating | Contact Length - Mating | Connector Type | Insulation Material | Contact Length - Post | Overall Contact Length | Material Flammability Rating | Termination | Fastening Type | Contact Finish - Mating | Contact Type | Number of Positions Loaded | Contact Finish - Post | Mounting Type | Shrouding | Row Spacing - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Board | 125 °C | -55 °C | Black | 10 µin | 4.8 A | 0.1 in | 1 | 18 | Phosphor Bronze | Square | 0.1 in | 0.23 in | Header | Liquid Crystal Polymer (LCP) | 0.122 in | 0.452 in | UL94 V-0 | Press-Fit Solder | Push-Pull | Gold | Male Pin | All | Tin | Through Hole | Unshrouded | |
Samtec Inc. | Board | 125 °C | -55 °C | Black | 10 µin | 4.8 A | 0.2 in | 2 | 14 | Phosphor Bronze | Square | 0.1 in | 0.23 in | Header | Liquid Crystal Polymer (LCP) | 0.122 in | 0.552 in | UL94 V-0 | Press-Fit Solder | Push-Pull | Gold | Male Pin | All | Tin | Through Hole | Unshrouded | 0.1 in |
Samtec Inc. | Board | 125 °C | -55 °C | Black | 10 µin | 4.8 A | 0.1 in | 2 | 44 | Phosphor Bronze | Square | 0.1 in | 0.23 in | Header | Liquid Crystal Polymer (LCP) | 0.122 in | 0.452 in | UL94 V-0 | Press-Fit Solder | Push-Pull | Gold | Male Pin | All | Tin | Through Hole | Unshrouded | 0.1 in |
Samtec Inc. | Board | 125 °C | -55 °C | Black | 30 µin | 4.8 A | 0.1 in | 1 | 6 | Phosphor Bronze | Square | 0.1 in | 0.23 in | Header | Liquid Crystal Polymer (LCP) | 0.122 in | 0.452 in | UL94 V-0 | Press-Fit Solder | Push-Pull | Gold | Male Pin | All | Tin | Through Hole | Unshrouded | |
Samtec Inc. | Board | 125 °C 125 C | -55 °C -55 C | Black | 10 µin 10 in | 4.8 A | 0.1 in | 2 | 64 | Phosphor Bronze | Square | 0.1 in | 0.23 in | Header | Liquid Crystal Polymer (LCP) | 0.122 in | 0.452 in | UL94 V-0 | Press-Fit Solder | Push-Pull | Gold | Male Pin | All | Tin | Through Hole | Unshrouded | 0.1 in |
Samtec Inc. | Board | 125 °C | -55 °C | Black | 10 µin | 4.8 A | 0.2 in | 2 | 40 | Phosphor Bronze | Square | 0.1 in | 0.23 in | Header | Liquid Crystal Polymer (LCP) | 0.122 in | 0.552 in | UL94 V-0 | Press-Fit Solder | Push-Pull | Gold | Male Pin | All | Tin | Through Hole | Unshrouded | 0.1 in |
Samtec Inc. | Board | 125 °C | -55 °C | Black | 10 µin | 4.8 A | 0.1 in | 1 | 40 | Phosphor Bronze | Square | 0.1 in | 0.23 in | Header | Liquid Crystal Polymer (LCP) | 0.122 in | 0.452 in | UL94 V-0 | Press-Fit Solder | Push-Pull | Gold | Male Pin | All | Tin | Through Hole | Unshrouded | |
Samtec Inc. | Board | 125 °C | -55 °C | Black | 10 µin | 4.8 A | 0.2 in | 1 | 6 | Phosphor Bronze | Square | 0.1 in | 0.23 in | Header | Liquid Crystal Polymer (LCP) | 0.122 in | 0.552 in | UL94 V-0 | Press-Fit Solder | Push-Pull | Gold | Male Pin | All | Tin | Through Hole | Unshrouded | |
Samtec Inc. | Board | 125 °C | -55 °C | Black | 10 µin | 4.8 A | 0.2 in | 2 | 50 | Phosphor Bronze | Square | 0.1 in | 0.23 in | Header | Liquid Crystal Polymer (LCP) | 0.122 in | 0.552 in | UL94 V-0 | Press-Fit Solder | Push-Pull | Gold | Male Pin | All | Tin | Through Hole | Unshrouded | 0.1 in |
Samtec Inc. | Board | 125 °C | -55 °C | Black | 10 µin | 4.8 A | 0.1 in | 2 | 8 | Phosphor Bronze | Square | 0.1 in | 0.23 in | Header | Liquid Crystal Polymer (LCP) | 0.122 in | 0.452 in | UL94 V-0 | Press-Fit Solder | Push-Pull | Gold | Male Pin | All | Tin | Through Hole | Unshrouded | 0.1 in |