SL-111 Series

Catalog

CONN RCPT 11POS 0.1 GOLD PCB

Part	Contact Material	Contact Shape	Insulation Material	Number of Positions Loaded	Pitch - Mating	Connector Type	Contact Finish Thickness - Mating	Insulation Color	Fastening Type	Mounting Type	Operating Temperature (Max)	Operating Temperature (Min)	Contact Finish - Mating	Termination	Number of Positions	Insulation Height	Number of Rows	Style	Contact Type	Contact Length - Post	Contact Finish - Post	Contact Finish Thickness - Post
Samtec Inc. SL-111-T-32	Beryllium Copper	Circular	Liquid Crystal Polymer (LCP)	All	0.1 in	Receptacle	30 µin	Black	Push-Pull	Through Hole	125 °C	-55 °C	Gold	Solder	11	0.05 in	1	Board	Female Socket
Samtec Inc. SL-111-TT-10	Beryllium Copper	Circular	Liquid Crystal Polymer (LCP)	All	0.1 in	Receptacle		Black	Push-Pull	Through Hole	105 °C	-55 °C	Tin	Solder	11	0.122 in	1	Board	Female Socket	0.108 in	Tin
Samtec Inc. SL-111-TT-11	Beryllium Copper	Circular	Liquid Crystal Polymer (LCP)	All	0.1 in	Receptacle		Black	Push-Pull	Through Hole	105 °C	-55 °C	Tin	Solder	11	0.132 in	1	Board	Female Socket	0.108 in	Tin
Samtec Inc. SL-111-G-32	Beryllium Copper	Circular	Liquid Crystal Polymer (LCP)	All	0.1 in	Receptacle	30 µin	Black	Push-Pull	Through Hole	125 °C	-55 °C	Gold	Solder	11	0.05 in	1	Board	Female Socket		Gold	10 µin
Samtec Inc. SL-111-T-12	Beryllium Copper	Circular	Liquid Crystal Polymer (LCP)	All	0.1 in	Receptacle	30 µin	Black	Push-Pull	Through Hole	125 °C	-55 °C	Gold	Solder	11	0.095 in	1	Board	Female Socket	0.095 in
Samtec Inc. SL-111-T-19	Beryllium Copper	Circular	Liquid Crystal Polymer (LCP)	All	0.1 in	Receptacle	30 µin	Black	Push-Pull	Through Hole	125 °C	-55 °C	Gold	Solder	11	0.05 in	1	Board	Female Socket	0.082 in
Samtec Inc. SL-111-G-11	Beryllium Copper	Circular	Liquid Crystal Polymer (LCP)	All	0.1 in	Receptacle	30 µin	Black	Push-Pull	Through Hole	125 °C	-55 °C	Gold	Solder	11	0.132 in	1	Board	Female Socket	0.108 in	Gold	10 µin