Beta
⌘K
CONN IC DIP SOCKET 18POS GOLD
| Part | Contact Material - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Current Rating (Amps) | Mounting Type | Type | Type | Type | Pitch - Mating | Pitch - Mating | Termination Post Length | Termination Post Length | Features | Contact Material - Post [custom] | Housing Material | Pitch - Post | Pitch - Post | Termination | Contact Finish - Post | Number of Positions or Pins (Grid) | Material Flammability Rating | Operating Temperature [Max] | Operating Temperature [Min] | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Beryllium Copper | 10 çin | 0.25 çm | 3 A | Through Hole | DIP | 0.6 in | 15.24 mm | 0.1 in | 2.54 mm | 3.56 mm | 0.14 in | Closed Frame Elevated | Brass | Glass Filled Nylon 4/6 Polyamide (PA46) | 2.54 mm | 0.1 in | Solder | Gold | 18 | UL94 V-0 | 105 ░C | -55 °C | Gold | 30 Áin | 0.76 Ám |