ZSSC3218 Series
Manufacturer: Renesas Electronics Corporation
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DICE (WAFER SAWN) - WAFFLE PACK
| Part | Applications | Interface | Package Width | Package Name | Package Length | Package / Case | Mounting Type | Voltage - Supply (Maximum) | Voltage - Supply (Minimum) | Supplied Contents | Contents | Utilized IC / Part | Function | Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Renesas Electronics Corporation | ||||||||||||||
 Renesas Electronics Corporation | Sensor Signal Conditioner - Resistive | I2C SPI | 4 mm | 24-QFN | 4 mm | 24-VFQFN Exposed Pad | Surface Mount | 3.6 V | 1.68 V | |||||
 Renesas Electronics Corporation | Board(s) | Board | ZSSC3218 | Sensor Signal Conditioner | Interface |