6030 Series
Manufacturer: Boyd Laconia, LLC
Beta
⌘K
BOARD LEVEL HEAT SINK
| Part | Thermal Resistance | Attachment Method | Package Cooled | Shape | Length | Material Finish | Material | Fin Height | Power Dissipation | Type | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|
 Boyd Laconia, LLC | 6 °C/W 12.5 °C/W | Bolt On PC Pin | TO-220 | Fins Rectangular | 1.18 in | Tin | Copper | 0.5 in | 1 W | Board Level Vertical | 1 in |