CONN HEADER SMD 4POS 1MM
| Part | Contact Material | Number of Positions | Number of Rows | Number of Positions Loaded | Contact Finish - Mating | Contact Shape | Contact Finish - Post | Fastening Type | Pitch - Mating | Pitch - Mating | Connector Type | Shrouding | Row Spacing - Mating | Row Spacing - Mating | Termination | Contact Length - Mating | Contact Length - Mating | Contact Type | Material Flammability Rating | Insulation Color | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Current Rating (Amps) | Insulation Material | Operating Temperature [Min] | Operating Temperature [Max] | Mounting Type | Insulation Height | Insulation Height | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Length - Mating [x] | Contact Length - Mating [x] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Phosphor Bronze | 4 | 2 | All | Gold | Square | Tin | Push-Pull | 0.039 in | 1 mm | Header | Unshrouded | 0.039 " | 1 mm | Solder | 0.065 in | 1.65 mm | Male Pin | UL94 V-0 | Black | 10 çin | 0.25 çm | 2.8 A per Contact | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | Surface Mount | 1.5 mm | 0.059 " | ||||
Samtec Inc. | Phosphor Bronze | 4 | 2 | All | Gold | Square | Gold | Push-Pull | 0.039 in | 1 mm | Header | Unshrouded | 0.039 " | 1 mm | Solder | 0.065 in | 1.65 mm | Male Pin | UL94 V-0 | Black | 30 Áin | 0.76 Ám | 2.8 A per Contact | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | Surface Mount | 1.5 mm | 0.059 " | 3 µin | 0.076 µm | ||
Samtec Inc. | Phosphor Bronze | 4 | 2 | All | Gold | Square | Gold | Push-Pull | 0.039 in | 1 mm | Header | Unshrouded | 0.039 " | 1 mm | Solder | Male Pin | UL94 V-0 | Black | 30 Áin | 0.76 Ám | 2.8 A per Contact | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | Surface Mount | 1.5 mm | 0.059 " | 3 µin | 0.076 µm | 1.9 mm | 0.075 in | ||
Samtec Inc. | Phosphor Bronze | 4 | 2 | All | Gold | Square | Tin | Push-Pull | 0.039 in | 1 mm | Header | Unshrouded | 0.039 " | 1 mm | Solder | Male Pin | UL94 V-0 | Black | 10 çin | 0.25 çm | 2.8 A per Contact | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | Surface Mount | 1.5 mm | 0.059 " | 1.9 mm | 0.075 in | ||||
Samtec Inc. | Phosphor Bronze | 4 | 2 | All | Gold | Square | Tin | Push-Pull | 0.039 in | 1 mm | Header | Unshrouded | 0.039 " | 1 mm | Solder | 0.065 in | 1.65 mm | Male Pin | UL94 V-0 | Black | 3 µin | 0.076 µm | 2.8 A per Contact | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | Surface Mount | 1.5 mm | 0.059 " | ||||
Samtec Inc. | Phosphor Bronze | 4 | 2 | All | Gold | Square | Tin | Push-Pull | 0.039 in | 1 mm | Header | Unshrouded | 0.039 " | 1 mm | Solder | 0.065 in | 1.65 mm | Male Pin | UL94 V-0 | Black | 10 çin | 0.25 çm | 2.8 A per Contact | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | Surface Mount | 1.5 mm | 0.059 " | ||||
Samtec Inc. | Phosphor Bronze | 4 | 2 | All | Gold | Square | Tin | Push-Pull | 0.039 in | 1 mm | Header | Unshrouded | 0.039 " | 1 mm | Solder | Male Pin | UL94 V-0 | Black | 10 çin | 0.25 çm | 2.8 A per Contact | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | Surface Mount | 1.5 mm | 0.059 " | 1.9 mm | 0.075 in | ||||
Samtec Inc. | Phosphor Bronze | 4 | 2 | All | Gold | Square | Tin | Push-Pull | 0.039 in | 1 mm | Header | Unshrouded | 0.039 " | 1 mm | Solder | Male Pin | UL94 V-0 | Black | 3 µin | 0.076 µm | 2.8 A per Contact | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | Surface Mount | 1.5 mm | 0.059 " | 1.9 mm | 0.075 in | ||||
Samtec Inc. | Phosphor Bronze | 4 | 2 | All | Gold | Square | Tin | Push-Pull | 0.039 in | 1 mm | Header | Unshrouded | 0.039 " | 1 mm | Solder | Male Pin | UL94 V-0 | Black | 10 çin | 0.25 çm | 2.8 A per Contact | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | Surface Mount | 1.5 mm | 0.059 " | 1.9 mm | 0.075 in |