CONN HEADER SMD 60POS 2MM
| Part | Contact Finish - Post | Mounting Type | Contact Type | Contact Shape | Insulation Height | Insulation Height | Row Spacing - Mating | Row Spacing - Mating | Shrouding | Contact Finish - Mating | Features | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Connector Type | Fastening Type | Insulation Material | Number of Positions | Style | Operating Temperature [Min] | Operating Temperature [Max] | Number of Positions Loaded | Contact Material | Insulation Color | Number of Rows | Current Rating (Amps) | Pitch - Mating [x] | Pitch - Mating [x] | Termination | Contact Length - Post | Contact Length - Post | Overall Contact Length | Overall Contact Length | Insulation Height [z] | Insulation Height [z] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Tin | Surface Mount | Male Pin | Square | 5.8 mm | 0.228 in | 0.079 in | 2 mm | Shrouded - 4 Wall | Gold | Mating Flange | 30 Áin | 0.76 Ám | Header | Push-Pull | Liquid Crystal Polymer (LCP) | 60 | Board to Board Cable | -55 °C | 125 °C | All | Phosphor Bronze | Black | 2 | 3.8 A | 0.079 in | 2 mm | Solder | ||||||
Samtec Inc. | Tin | Surface Mount | Male Pin | Square | 5.8 mm | 0.228 in | 0.079 in | 2 mm | Shrouded - 4 Wall | Gold | Pick and Place Solder Retention | 10 çin | 0.25 çm | Header | Push-Pull | Liquid Crystal Polymer (LCP) | 60 | Board to Board Cable | -55 °C | 125 °C | All | Phosphor Bronze | Black | 2 | 3.8 A | 0.079 in | 2 mm | Solder | ||||||
Samtec Inc. | Tin | Through Hole | Male Pin | Square | 5.8 mm | 0.228 in | 0.079 in | 2 mm | Shrouded - 4 Wall | Gold | Solder Retention | 30 Áin | 0.76 Ám | Header | Push-Pull | Liquid Crystal Polymer (LCP) | 60 | Board to Board Cable | -55 °C | 125 °C | All | Phosphor Bronze | Black | 2 | 3.8 A | 0.079 in | 2 mm | Solder | 0.117 in | 2.97 mm | 0.302 in | 7.67 mm | ||
Samtec Inc. | Tin | Through Hole Right Angle | Male Pin | Square | 0.079 in | 2 mm | Shrouded - 4 Wall | Gold | Solder Retention | 10 çin | 0.25 çm | Header | Push-Pull | Liquid Crystal Polymer (LCP) | 60 | Board to Board Cable | -55 °C | 125 °C | All | Phosphor Bronze | Black | 2 | 3.8 A | 0.079 in | 2 mm | Solder | 0.09 " | 2.29 mm | 7.44 mm | 0.293 in | ||||
Samtec Inc. | Tin | Surface Mount | Male Pin | Square | 5.8 mm | 0.228 in | 0.079 in | 2 mm | Shrouded - 4 Wall | Gold | Mating Flange | 30 Áin | 0.76 Ám | Header | Push-Pull | Liquid Crystal Polymer (LCP) | 60 | Board to Board Cable | -55 °C | 125 °C | All | Phosphor Bronze | Black | 2 | 3.8 A | 0.079 in | 2 mm | Solder | ||||||
Samtec Inc. | Tin | Through Hole | Male Pin | Square | 5.8 mm | 0.228 in | 0.079 in | 2 mm | Shrouded - 4 Wall | Gold | 10 çin | 0.25 çm | Header | Push-Pull | Liquid Crystal Polymer (LCP) | 60 | Board to Board Cable | -55 °C | 125 °C | All | Phosphor Bronze | Black | 2 | 3.8 A | 0.079 in | 2 mm | Solder | 0.117 in | 2.97 mm | 0.302 in | 7.67 mm | |||
Samtec Inc. | Tin | Surface Mount | Male Pin | Square | 5.8 mm | 0.228 in | 0.079 in | 2 mm | Shrouded - 4 Wall | Gold | Mating Flange Pick and Place | 30 Áin | 0.76 Ám | Header | Push-Pull | Liquid Crystal Polymer (LCP) | 60 | Board to Board Cable | -55 °C | 125 °C | All | Phosphor Bronze | Black | 2 | 3.8 A | 0.079 in | 2 mm | Solder | ||||||
Samtec Inc. | Tin | Through Hole | Male Pin | Square | 5.8 mm | 0.228 in | 0.079 in | 2 mm | Shrouded - 4 Wall | Gold | 30 Áin | 0.76 Ám | Header | Push-Pull | Liquid Crystal Polymer (LCP) | 60 | Board to Board Cable | -55 °C | 125 °C | All | Phosphor Bronze | Black | 2 | 3.8 A | 0.079 in | 2 mm | Solder | 0.117 in | 2.97 mm | 0.302 in | 7.67 mm | |||
Samtec Inc. | Tin | Surface Mount | Male Pin | Square | 5.8 mm | 0.228 in | 0.079 in | 2 mm | Shrouded - 4 Wall | Gold | Pick and Place | 10 çin | 0.25 çm | Header | Push-Pull | Liquid Crystal Polymer (LCP) | 60 | Board to Board Cable | -55 °C | 125 °C | All | Phosphor Bronze | Black | 2 | 3.8 A | 0.079 in | 2 mm | Solder |