T2M-130 Series

Catalog

PIN HEADER, 60POS, 2ROW, 2MM, THT ROHS COMPLIANT: YES

Part	Current Rating	Termination	Row Spacing - Mating	Mounting Type	Features	Insulation Material	Contact Material	Number of Rows	Overall Contact Length	Pitch - Mating	Shrouding	Contact Shape	Contact Finish Thickness - Mating	Contact Finish - Mating	Insulation Height	Contact Length - Post	Contact Finish - Post	Number of Positions	Connector Type	Contact Type	Insulation Color	Operating Temperature (Max)	Operating Temperature (Min)	Fastening Type	Number of Positions Loaded	Style
Samtec Inc. T2M-130-01-L-D-TH-DS	2.6 A 3.8 A	Solder	0.079 in	Through Hole	Mating Flange	Liquid Crystal Polymer (LCP)	Phosphor Bronze	2	0.302 in	0.079 in	Shrouded - 4 Wall	Square	10 µin	Gold	0.228 in	0.117 in	Tin	60	Header	Male Pin	Black	125 °C	-55 °C	Push-Pull	All	Board Board or Cable
Samtec Inc. T2M-130-01-S-D-SM-DS	2.6 A 3.8 A	Solder	0.079 in	Surface Mount	Mating Flange	Liquid Crystal Polymer (LCP)	Phosphor Bronze	2		0.079 in	Shrouded - 4 Wall	Square	30 µin	Gold	0.228 in		Tin	60	Header	Male Pin	Black	125 °C	-55 °C	Push-Pull	All	Board Board or Cable
Samtec Inc. T2M-130-01-L-D-SM-WT-K	2.6 A 3.8 A	Solder	0.079 in	Surface Mount	Pick and Place Solder Retention	Liquid Crystal Polymer (LCP)	Phosphor Bronze	2		0.079 in	Shrouded - 4 Wall	Square	10 µin	Gold	0.228 in		Tin	60	Header	Male Pin	Black	125 °C	-55 °C	Push-Pull	All	Board Board or Cable
Samtec Inc. T2M-130-01-L-D-TH-WT	2.6 A 3.8 A	Solder	0.079 in	Through Hole	Solder Retention	Liquid Crystal Polymer (LCP)	Phosphor Bronze	2	0.302 in	0.079 in	Shrouded - 4 Wall	Square	10 µin	Gold	0.228 in	0.117 in	Tin	60	Header	Male Pin	Black	125 °C	-55 °C	Push-Pull	All	Board Board or Cable
Samtec Inc. T2M-130-01-S-D-TH-WT	2.6 A 3.8 A	Solder	0.079 in	Through Hole	Solder Retention	Liquid Crystal Polymer (LCP)	Phosphor Bronze	2	0.302 in	0.079 in	Shrouded - 4 Wall	Square	30 µin	Gold	0.228 in	0.117 in	Tin	60	Header	Male Pin	Black	125 °C	-55 °C	Push-Pull	All	Board Board or Cable
Samtec Inc. T2M-130-01-L-D-RA-WT	2.6 A 3.8 A	Solder	0.079 in	Right Angle Through Hole	Solder Retention	Liquid Crystal Polymer (LCP)	Phosphor Bronze	2		0.079 in	Shrouded - 4 Wall	Square	10 µin	Gold	0.293 in	0.09 in	Tin	60	Header	Male Pin	Black	125 °C	-55 °C	Push-Pull	All	Board Board or Cable
Samtec Inc. T2M-130-01-S-D-RA-WT	2.6 A 3.8 A	Solder	0.079 in	Right Angle Through Hole	Solder Retention	Liquid Crystal Polymer (LCP)	Phosphor Bronze	2		0.079 in	Shrouded - 4 Wall	Square	30 µin	Gold	0.293 in	0.09 in	Tin	60	Header	Male Pin	Black	125 °C	-55 °C	Push-Pull	All	Board Board or Cable
Samtec Inc. T2M-130-01-S-D-SM-DS-TR	2.6 A 3.8 A	Solder	0.079 in	Surface Mount	Mating Flange	Liquid Crystal Polymer (LCP)	Phosphor Bronze	2		0.079 in	Shrouded - 4 Wall	Square	30 µin	Gold	0.228 in		Tin	60	Header	Male Pin	Black	125 °C	-55 °C	Push-Pull	All	Board Board or Cable
Samtec Inc. T2M-130-01-L-D-TH	2.6 A 3.8 A	Solder	0.079 in	Through Hole		Liquid Crystal Polymer (LCP)	Phosphor Bronze	2	0.302 in	0.079 in	Shrouded - 4 Wall	Square	10 µin	Gold	0.228 in	0.117 in	Tin	60	Header	Male Pin	Black	125 °C	-55 °C	Push-Pull	All	Board Board or Cable
Samtec Inc. T2M-130-01-S-D-TH	2.6 A 3.8 A	Solder	0.079 in	Through Hole		Liquid Crystal Polymer (LCP)	Phosphor Bronze	2	0.302 in	0.079 in	Shrouded - 4 Wall	Square	30 µin	Gold	0.228 in	0.117 in	Tin	60	Header	Male Pin	Black	125 °C	-55 °C	Push-Pull	All	Board Board or Cable