TLW-131 Series

Catalog

CONN HEADER VERT 31POS 2.54MM

Part	Contact Type	Current Rating (Per Contact)	Insulation Color	Pitch - Mating	Style	Number of Positions	Insulation Height	Contact Material	Contact Shape	Overall Contact Length	Number of Rows	Fastening Type	Mounting Type	Number of Positions Loaded	Contact Finish - Mating	Shrouding	Operating Temperature (Min)	Operating Temperature (Max)	Contact Length - Post	Contact Length - Mating	Termination	Connector Type	Insulation Material	Contact Finish - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post (string_set)	Row Spacing - Mating
Samtec Inc. TLW-131-05-T-S	Male Pin	5.2 A	Black	0.1 in	Board Board or Cable	31	0.06 in	Phosphor Bronze	Square	0.335 in	1	Push-Pull	Through Hole	All	Tin	Unshrouded	-55 °C	105 °C	0.17 in	0.105 in	Solder	Header	Liquid Crystal Polymer (LCP)	Tin
Samtec Inc. TLW-131-06-G-S	Male Pin	5.2 A	Black	0.1 in	Board Board or Cable	31	0.06 in	Phosphor Bronze	Square	0.3 in	1	Push-Pull	Through Hole	All	Gold	Unshrouded	-55 °C	125 °C	0.135 in	0.105 in	Solder	Header	Liquid Crystal Polymer (LCP)	Gold	10 µin	Flash	Flash
Samtec Inc. TLW-131-05-G-S	Male Pin	5.2 A	Black	0.1 in	Board Board or Cable	31	0.06 in	Phosphor Bronze	Square	0.335 in	1	Push-Pull	Through Hole	All	Gold	Unshrouded	-55 °C	125 °C	0.17 in	0.105 in	Solder	Header	Liquid Crystal Polymer (LCP)	Gold	10 µin	Flash	Flash
Samtec Inc. TLW-131-05-T-D	Male Pin	5.2 A	Black	0.1 in	Board Board or Cable	62	0.06 in	Phosphor Bronze	Square	0.335 in	2	Push-Pull	Through Hole	All	Tin	Unshrouded	-55 °C	105 °C	0.17 in	0.105 in	Solder	Header	Liquid Crystal Polymer (LCP)	Tin				0.1 in
Samtec Inc. TLW-131-06-G-D	Male Pin	5.2 A	Black	0.1 in	Board Board or Cable	62	0.06 in	Phosphor Bronze	Square	0.3 in	2	Push-Pull	Through Hole	All	Gold	Unshrouded	-55 °C	125 °C	0.135 in	0.105 in	Solder	Header	Liquid Crystal Polymer (LCP)	Gold	10 µin	Flash	Flash	0.1 in
Samtec Inc. TLW-131-05-G-D	Male Pin	5.2 A	Black	0.1 in	Board Board or Cable	62	0.06 in	Phosphor Bronze	Square	0.335 in	2	Push-Pull	Through Hole	All	Gold	Unshrouded	-55 °C	125 °C	0.17 in	0.105 in	Solder	Header	Liquid Crystal Polymer (LCP)	Gold	10 µin	Flash	Flash	0.1 in