28-6518 Series

Catalog

CONN IC DIP SOCKET 28POS GOLD

Part	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Contact Finish - Mating	Housing Material	Current Rating (Amps)	Contact Finish - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Termination Post Length	Termination Post Length	Material Flammability Rating	Pitch - Post	Pitch - Post	Type	Type	Type	Termination	Mounting Type	Features	Contact Material - Post [custom]	Number of Positions or Pins (Grid)
Aries Electronics 28-6518-11H	0.1 in	2.54 mm	10 çin	0.25 çm	Beryllium Copper	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)	3 A	Gold	10 çin	0.25 çm	3.18 mm	0.125 in	UL94 V-0	2.54 mm	0.1 in	DIP	0.6 in	15.24 mm	Solder	Through Hole	Open Frame	Brass	28
Aries Electronics 28-6518-10	0.1 in	2.54 mm	10 çin	0.25 çm	Beryllium Copper	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)	3 A	Tin	200 µin	5.08 µm	3.18 mm	0.125 in	UL94 V-0	2.54 mm	0.1 in	DIP	0.6 in	15.24 mm	Solder	Through Hole	Open Frame	Brass	28
Aries Electronics 28-6518-01	0.1 in	2.54 mm	10 çin	0.25 çm	Beryllium Copper	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)	3 A	Gold	10 çin	0.25 çm	3.18 mm	0.125 in	UL94 V-0	2.54 mm	0.1 in	DIP	0.6 in	15.24 mm	Solder	Through Hole	Open Frame	Brass	28