28-6518 Series

Catalog

CONN IC DIP SOCKET 28POS GOLD

Part	Termination Post Length	Material Flammability Rating	Current Rating	Contact Finish Thickness - Post	Grid Columns	Number of Positions or Pins (Grid)	Grid Rows	Housing Material	Row Spacing	Type	Contact Finish - Mating	Pitch - Post	Contact Material - Post	Contact Material - Mating	Mounting Type	Termination	Contact Finish - Post	Features	Pitch - Mating	Contact Finish Thickness - Mating
Aries Electronics 28-6518-00	0.125 in	UL94 V-0	3 A	200 µin	14	28	2	Glass Filled Nylon 4/6 PA46 Polyamide	0.6 in	0.6" (15.24mm) Row Spacing DIP	Gold	0.1 in	Brass	Beryllium Copper	Surface Mount	Solder	Tin	Open Frame	0.1 in	10 µin
Aries Electronics 28-6518-11H	0.125 in	UL94 V-0	3 A	10 µin	14	28	2	Glass Filled Nylon 4/6 PA46 Polyamide	0.6 in	0.6" (15.24mm) Row Spacing DIP	Gold	0.1 in	Brass	Beryllium Copper	Through Hole	Solder	Gold	Open Frame	0.1 in	10 µin
Aries Electronics 28-6518-10	0.125 in	UL94 V-0	3 A	200 µin	14	28	2	Glass Filled Nylon 4/6 PA46 Polyamide	0.6 in	0.6" (15.24mm) Row Spacing DIP	Gold	0.1 in	Brass	Beryllium Copper	Through Hole	Solder	Tin	Open Frame	0.1 in	10 µin
Aries Electronics 28-6518-112	0.125 in	UL94 V-0	3 A	10 µin	14	28	2	Glass Filled Nylon 4/6 PA46 Polyamide	0.6 in	0.6" (15.24mm) Row Spacing DIP	Gold	0.1 in	Brass	Beryllium Copper	Through Hole	Solder	Gold	Open Frame	0.1 in	10 µin
Aries Electronics 28-6518-01	0.125 in	UL94 V-0	3 A	10 µin	14	28	2	Glass Filled Nylon 4/6 PA46 Polyamide	0.6 in	0.6" (15.24mm) Row Spacing DIP	Gold	0.1 in	Brass	Beryllium Copper	Through Hole	Solder	Gold	Open Frame	0.1 in	10 µin