ESD-109 Series
Manufacturer: Samtec Inc.
CONN SOCKET 18POS 0.1 GOLD PCB
| Part | Insulation Color | Termination | Contact Finish - Post | Fastening Type | Row Spacing - Mating | Operating Temperature (Max) | Operating Temperature (Min) | Contact Type | Number of Positions Loaded | Contact Finish Thickness - Mating | Material Flammability Rating | Connector Type | Pitch - Mating | Contact Length - Post | Number of Positions | Mounting Type | Contact Finish - Mating | Number of Rows | Insulation Height | Style | Contact Material | Contact Shape | Insulation Material | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Black | Solder | Gold | Push-Pull | 0.1 in | 125 °C | -55 °C | Female Socket | All | 10 µin | UL94 V-0 | Elevated Socket | 0.1 in | 0.215 in | 18 | Through Hole | Gold | 2 | 0.3 in | Board | Beryllium Copper | Circular | Liquid Crystal Polymer (LCP) | 10 µin |
Samtec Inc. | Black | Solder | Tin | Push-Pull | 0.1 in | 125 °C | -55 °C | Female Socket | All | 10 µin | UL94 V-0 | Elevated Socket | 0.1 in | 0.165 in | 18 | Through Hole | Gold | 2 | 0.5 in | Board | Beryllium Copper | Circular | Liquid Crystal Polymer (LCP) | |
Samtec Inc. | Black | Solder | Gold | Push-Pull | 0.1 in | 125 °C | -55 °C | Female Socket | All | 10 µin | UL94 V-0 | Elevated Socket | 0.1 in | 0.265 in | 18 | Through Hole | Gold | 2 | 0.4 in | Board | Beryllium Copper | Circular | Liquid Crystal Polymer (LCP) | 10 µin |
Samtec Inc. | Black | Solder | Gold | Push-Pull | 0.1 in | 125 °C | -55 °C | Female Socket | All | 10 µin | UL94 V-0 | Elevated Socket | 0.1 in | 0.165 in | 18 | Through Hole | Gold | 2 | 0.5 in | Board | Beryllium Copper | Circular | Liquid Crystal Polymer (LCP) | 10 µin |
Samtec Inc. | Black | Solder | Tin | Push-Pull | 0.1 in | 125 °C | -55 °C | Female Socket | All | 10 µin | UL94 V-0 | Elevated Socket | 0.1 in | 0.265 in | 18 | Through Hole | Gold | 2 | 0.4 in | Board | Beryllium Copper | Circular | Liquid Crystal Polymer (LCP) | |
Samtec Inc. | Black | Solder | Gold | Push-Pull | 0.1 in | 125 °C | -55 °C | Female Socket | All | 10 µin | UL94 V-0 | Elevated Socket | 0.1 in | 0.165 in | 18 | Through Hole | Gold | 2 | 0.5 in | Board | Beryllium Copper | Circular | Liquid Crystal Polymer (LCP) | 10 µin |
Samtec Inc. | Black | Solder | Tin | Push-Pull | 0.1 in | 125 °C | -55 °C | Female Socket | All | 10 µin | UL94 V-0 | Elevated Socket | 0.1 in | 0.215 in | 18 | Through Hole | Gold | 2 | 0.3 in | Board | Beryllium Copper | Circular | Liquid Crystal Polymer (LCP) |